| Package Type | BGA (Ball Grid Array) |
|---|---|
| Grade | Commercial Grade |
| Sequential Write Speed | Up To 240 MB/s |
| Controller | SMI |
| Operating Voltage | 2.7V - 3.6V |
| Features | Advanced Wear Leveling, Bad Block Management, TRIM Support, Power Loss Protection, Secure Write Protection |
|---|---|
| Nand Flash | MLC/TLC/QLC |
| Wafer | Industrial Grade KIOXIA Wafer |
| Operating Temperature | -25°C To +85°C |
| Standard | EMMC 5.1 |
| Features | Advanced Wear Leveling, Bad Block Management, TRIM Support, Power Loss Protection, Secure Write Protection |
|---|---|
| Protocol | HS400 |
| Voltage | 2.7V-3.6V |
| Manufacturer | PG |
| Color | Black |
| Memory | Flash |
|---|---|
| Custom | Support |
| Origin | China |
| Sequential Write Speed | Up To 240 MB/s |
| Standard | EMMC 5.1 |
| Condition | Good |
|---|---|
| Agreement | HS400 |
| Interface | MMC (MultiMediaCard) Interface |
| Sequential Write Speed | Up To 240 MB/s |
| Orign | China |
| Capacity | 64GB-256GB |
|---|---|
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -40℃~+85℃/-45℃~+105℃ |
| Choice Of Flash | MLC/3DTLC/QLC NAND |
| Standard | EMMC 5.1 |
|---|---|
| Use Case | Learning Tablets |
| Read Speed | Up To 330MB/S |
| Aplication | Vehicle Communication And Control |
| Package | BGA153 Package |
| Name | PG Industrial Grade EMMC 5.1 |
|---|---|
| Capacity | 64GB / 128GB / 256GB / 512GB |
| OEM | Support |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Origin | China |
|---|---|
| Product Name | Automotive Grade EMMC 5.1 |
| Nand Flash Type | 3D NAND |
| Capacity | 64 128 256G |
| Read Speed | Up To 330MB/S |
| Product Name | Automotive Grade Emmc Memory Chips |
|---|---|
| Controller | SMI |
| Wafer | KIOXIA |
| Capacity | 64GB / 128GB / 256GB |
| Write Speed | 240MB/s |