| Product | Automotive EMMC 5.1 |
|---|---|
| Use Case | Automotive Radar & ADAS |
| Factory | Yes |
| Write Speed | Up To 240 MB/s |
| Packeage Type | 153 FBGA |
| Agreement | HS400 |
|---|---|
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Choice Of Flash | MLC/3DTLC/QLC NAND |
| Features | Advanced Wear Leveling, Bad Block Management, TRIM Support, Power Loss Protection, Secure Write Protection |
|---|---|
| Nand Flash | MLC/TLC/QLC |
| Wafer | Industrial Grade KIOXIA Wafer |
| Operating Temperature | -25°C To +85°C |
| Standard | EMMC 5.1 |
| Package Type | BGA (Ball Grid Array) |
|---|---|
| Grade | Commercial Grade |
| Sequential Write Speed | Up To 240 MB/s |
| Operating Voltage | 2.7V - 3.6V |
| Storage Apacity | 256GB 64GB 128GB |
| Package Type | BGA (Ball Grid Array) |
|---|---|
| Grade | Commercial Grade |
| Sequential Write Speed | Up To 240 MB/s |
| Operating Voltage | 2.7V - 3.6V |
| Storage Apacity | 256GB 64GB 128GB |
| Nand | PSLC |
|---|---|
| Compatible | Portable Gaming Console |
| Temperature Range | -25°C To 85°C (commercial Grade) |
| Oem | Support |
| Package | BGA Package |
| Features | Advanced Wear Leveling, Bad Block Management, TRIM Support, Power Loss Protection, Secure Write Protection |
|---|---|
| Protocol | HS400 |
| Voltage | 2.7V-3.6V |
| Manufacturer | PG |
| Color | Black |
| Product Status | New |
|---|---|
| Nand Flash Type | 3D NAND |
| Command Set | MMC Command Set With Extended Commands For EMMC |
| Sequential Write Speed | Up To 240 MB/s |
| Agreement | HS400 |
| Custom | Support |
|---|---|
| Package Type | BGA (Ball Grid Array) |
| Partitioning | Supports Multiple Partitions Including RPMB, GP Partitions |
| Compatibility | Smartphone |
| Bus Width | 8-bit |
| Warranty | 1 Years |
|---|---|
| Key Features | Embedde EMMC Memory Flash Chips |
| Sequential Write Speed | Up To 240 MB/s |
| Logo | Customized |
| Standard | EMMC 5.1 |