| Agreement | HS400 |
|---|---|
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Choice Of Flash | MLC/3DTLC/QLC NAND |
| Package Type | BGA (Ball Grid Array) |
|---|---|
| Grade | Commercial Grade |
| Sequential Write Speed | Up To 240 MB/s |
| Controller | SMI |
| Operating Voltage | 2.7V - 3.6V |
| Package Type | BGA (Ball Grid Array) |
|---|---|
| Grade | Commercial Grade |
| Sequential Write Speed | Up To 240 MB/s |
| Controller | SMI |
| Operating Voltage | 2.7V - 3.6V |
| Package Type | BGA (Ball Grid Array) |
|---|---|
| Grade | Commercial Grade |
| Sequential Write Speed | Up To 240 MB/s |
| Controller | SMI |
| Operating Voltage | 2.7V - 3.6V |
| Nand Flash | TLC/QLC |
|---|---|
| Series | Libre |
| Max Write Speed | 240MB/s |
| Wear Leveling | Supported |
| Read Speed | Up To 330MB/s |
| Condition | Good |
|---|---|
| Agreement | HS400 |
| Interface | MMC (MultiMediaCard) Interface |
| Sequential Write Speed | Up To 240 MB/s |
| Orign | China |