| Warranty | 1 Years |
|---|---|
| Key Features | Embedde EMMC Memory Flash Chips |
| Sequential Write Speed | Up To 240 MB/s |
| Logo | Customized |
| Standard | EMMC 5.1 |
| Sequential Write Speed | Up To 240 MB/s |
|---|---|
| Factory | Yes |
| Feature | Low |
| Weight | About 16g |
| Material | Plastic |
| Operating Temperature | -45℃~+105℃ |
|---|---|
| Warranty | 1 Years |
| Key Features | Good Quality, High Performance |
| Manufacturer | PG |
| Capacity | Typically Ranges From 64GB To 256GB |
| Dimensions | 11.5mm X 13mm X 1.0mm |
|---|---|
| Memory | Flash |
| Operating Temperature | -40℃~+105℃ |
| Aplication | Tablet Computer |
| Reliability | Enhanced Data Reliability Features |
| Form Factor | BGA (Ball Grid Array) |
|---|---|
| Choice Of Flash | MLC / 3D TLC / QLC NAND |
| Error Correction | Built-in ECC (Error Correction Code) |
| Reliability | Improved Error Correction And Wear Leveling |
| Quality | New |
| Custom | Support |
|---|---|
| Package Type | BGA (Ball Grid Array) |
| Partitioning | Supports Multiple Partitions Including RPMB, GP Partitions |
| Compatibility | Smartphone |
| Bus Width | 8-bit |
| Choice Of Flash | MLC / 3D TLC / QLC NAND |
|---|---|
| Power Management | Advanced Power Management Features |
| Enhanced Strobe | Supported |
| Aplication | Vehicle Communication And Control |
| Protocol | HS400 |
| Standard | EMMC 5.1 |
|---|---|
| Agreement | HS400 |
| Dimensions | 11.5mm X 13mm X 1.0mm |
| Voltage | 1.8V / 3.3V |
| Packeage Type | 153BGA |
| Memory | Flash |
|---|---|
| Voltage | 1.8V And 3.3V |
| Orign | China |
| Form Factor | BGA (Ball Grid Array) |
| Reliability | Enhanced Reliability Features Including Enhanced Data Protection |
| Products Status | New |
|---|---|
| Logo | Customized Logo |
| Voltage | 1.8V / 3.3V |
| Origin | SZ |
| Wafer | KIOXIA |