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eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board

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eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board
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Features
Specifications
Product Name: EMMC 5.1
Use For: TV Board
Warranty: 1 Year
Nand Flash: TLC
Capacity: 32GB/64GB
Sequential Write Speed: Up To 240 MB/s
Appearance: 11.5mmx13mmx1.0mm
Protocol: HS400
Highlight:

eMMC 32GB

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eMMC TLC

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eMMC Chip for TV Board
Basic Infomation
Place of Origin: Shenzhen, China
Brand Name: PG
Model Number: G2532GTLCB/G2864GTLCB
Payment & Shipping Terms
Delivery Time: 10 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month
Product Description
eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board 
This eMMC 5.1 embedded flash chip from China Chips Star is specially designed for TV boards and various embedded devices. Our eMMC 5.1 adopts original SK Hynix NAND Flash wafer, it integrates the standard eMMC 5.1 interface and is available in 32GB and 64GB mainstream capacities. Featuring high performance, high stability and low power consumption, it is perfectly suitable for smart TV system firmware, application data storage and multimedia caching scenarios.

Core Component Advantages of eMMC 5.1

Original SK Hynix NAND Flash Wafer

  • Reliable Quality: Original Hynix wafer with 3D TLC architecture, featuring mature process, excellent consistency and high yield, suitable for stable mass production and supply.
  • Durable Read/Write Performance: TLC architecture combined with controller optimization, offering a minimum of 3000 P/E cycles, far exceeding daily write demands for TV system updates and application installations.

EMMC 5.1 Specification Comparison
Model G2532GTLCB G2564GTLCB G25128TLCB
NAND Flash 3DTLC NAND 3DTLC NAND 3DTLC NAND
Capacity 32GB 64GB 128GB
CE 1 1 2
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature -25℃~85℃ -25℃~85℃ -25℃~85℃
EP ≥3000 ≥3000 ≥3000
Packaging Specification BGA 153 BGA 153 BGA 153
Size 11.5mm×13mm×1.0mm 11.5mm×13mm×1.0mm 11.5mm×13mm×1.2mm
Manufacturer: China Chips Star Semiconductor Co., Ltd.
EMMC chip close-up view showing BGA 153 package details
EMMC chip packaging and labeling specifications
EMMC chip dimensional measurements and physical characteristics
EMMC chip integration in electronic device applications
Tag:

Embedded eMMC5.1

eMMC BGA153

Memory Chip IC eMMC

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Tel : +8615712055204
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