eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board
Product Specification
Place of Origin:
Shenzhen, China
Brand Name:
PG
Model Number:
G2532GTLCB/G2864GTLCB
Minimum Order Quantity:
50pcs
Price:
Negotiable
Delivery Time:
10 to 15 days
Payment Terms:
L/C,T/T
Supply Ability:
100K a month
Product Summary
eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board This eMMC 5.1 embedded flash chip from China Chips Star is specially designed for TV boards and various embedded devices. Our eMMC 5.1 adopts original SK Hynix NAND Flash wafer, it integrates the standard eMMC 5.1 interface and is available ...
Product Details
Highlight:
eMMC 32GB
,eMMC TLC
,eMMC Chip for TV Board
Product Name:
EMMC 5.1
Use For:
TV Board
Warranty:
1 Year
Nand Flash:
TLC
Capacity:
32GB/64GB
Sequential Write Speed:
Up To 240 MB/s
Appearance:
11.5mmx13mmx1.0mm
Protocol:
HS400
Product Description
eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board
This eMMC 5.1 embedded flash chip from China Chips Star is specially designed for TV boards and various embedded devices. Our eMMC 5.1 adopts original SK Hynix NAND Flash wafer, it integrates the standard eMMC 5.1 interface and is available in 32GB and 64GB mainstream capacities. Featuring high performance, high stability and low power consumption, it is perfectly suitable for smart TV system firmware, application data storage and multimedia caching scenarios.
Core Component Advantages of eMMC 5.1
Original SK Hynix NAND Flash Wafer
- Reliable Quality: Original Hynix wafer with 3D TLC architecture, featuring mature process, excellent consistency and high yield, suitable for stable mass production and supply.
- Durable Read/Write Performance: TLC architecture combined with controller optimization, offering a minimum of 3000 P/E cycles, far exceeding daily write demands for TV system updates and application installations.
EMMC 5.1 Specification Comparison
| Model | G2532GTLCB | G2564GTLCB | G25128TLCB |
|---|---|---|---|
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 32GB | 64GB | 128GB |
| CE | 1 | 1 | 2 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.2mm |
Manufacturer: China Chips Star Semiconductor Co., Ltd.
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