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Quality EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box BGA 153 EMMC G2564GTLCB Model factory
Quality EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box BGA 153 EMMC G2564GTLCB Model factory
Quality EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box BGA 153 EMMC G2564GTLCB Model factory

EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box BGA 153 EMMC G2564GTLCB Model

Product Specification
Place of Origin: Shenzhen, China
Brand Name: PG
Model Number: G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB
Minimum Order Quantity: 50pcs
Price: Negotiable
Delivery Time: 10 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month

Product Summary

EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box eMMC is an embedded storage solution that integrates NAND flash memory particles and a storage controller within a single package. The eMMC chip model G2564GTLCB is manufactured by China Chips Star Semiconductor Co., Ltd and strictly complies with the ...

Product Details

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64GB EMMC 5.1 chip

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EMMC chip for set-top box

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BGA 153 EMMC module

Custom: Support
Error Correction: Built-in ECC (Error Correction Code)
Warranty: 1 Year
Nand Flash: TLC
Capacity: Typically Ranges From 64GB To 256GB
Sequential Write Speed: Up To 240 MB/s
Appearance: 11.5mmx13mmx1.0mm
Protocol: HS400

Product Description

EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box
eMMC is an embedded storage solution that integrates NAND flash memory particles and a storage controller within a single package. The eMMC chip model G2564GTLCB is manufactured by China Chips Star Semiconductor Co., Ltd and strictly complies with the JEDEC eMMC 5.1 industry standard specification. This chip is specifically designed for embedded application scenarios such as smart TVs and set-top boxes.
Key Features of EMMC Chips
  • Available in multiple capacity options including 32GB and 64GB
  • Standard BGA 153 ball grid array package
  • Compact dimensions: 11.5mm x 13mm x 1.0mm
  • Excellent shock resistance and high integration
  • Ideal for electronic devices with compact internal spaces
  • Sufficient storage for high-definition video caching, application installation, and system operation
EMMC 5.1 Specification Comparison
Model G2864GTLCB G28128TLCB G28256TLCB
NAND Flash 3DTLC NAND 3DTLC NAND 3DTLC NAND
Capacity 64GB 128GB 256GB
CE 1 2 4
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature -25℃~85℃ -25℃~85℃ -25℃~85℃
EP ≥3000 ≥3000 ≥3000
Packaging Specification BGA 153 BGA 153 BGA 153
Size 11.5mm×13mm×1.0mm 11.5mm×13mm×1.0mm 11.5mm×13mm×1.2mm
Manufacturer: China Chips Star Semiconductor Co., Ltd.
EMMC chip close-up view showing BGA 153 package details
EMMC chip packaging and labeling specifications
EMMC chip dimensional measurements and physical characteristics
EMMC chip integration in electronic device applications
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