EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box BGA 153 EMMC G2564GTLCB Model
Product Specification
Place of Origin:
Shenzhen, China
Brand Name:
PG
Model Number:
G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB
Minimum Order Quantity:
50pcs
Price:
Negotiable
Delivery Time:
10 to 15 days
Payment Terms:
L/C,T/T
Supply Ability:
100K a month
Product Summary
EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box eMMC is an embedded storage solution that integrates NAND flash memory particles and a storage controller within a single package. The eMMC chip model G2564GTLCB is manufactured by China Chips Star Semiconductor Co., Ltd and strictly complies with the ...
Product Details
Highlight:
64GB EMMC 5.1 chip
,EMMC chip for set-top box
,BGA 153 EMMC module
Custom:
Support
Error Correction:
Built-in ECC (Error Correction Code)
Warranty:
1 Year
Nand Flash:
TLC
Capacity:
Typically Ranges From 64GB To 256GB
Sequential Write Speed:
Up To 240 MB/s
Appearance:
11.5mmx13mmx1.0mm
Protocol:
HS400
Product Description
EMMC Chips 64GB 32GB EMMC 5.1 For TV Set-top Box
eMMC is an embedded storage solution that integrates NAND flash memory particles and a storage controller within a single package. The eMMC chip model G2564GTLCB is manufactured by China Chips Star Semiconductor Co., Ltd and strictly complies with the JEDEC eMMC 5.1 industry standard specification. This chip is specifically designed for embedded application scenarios such as smart TVs and set-top boxes.
Key Features of EMMC Chips
- Available in multiple capacity options including 32GB and 64GB
- Standard BGA 153 ball grid array package
- Compact dimensions: 11.5mm x 13mm x 1.0mm
- Excellent shock resistance and high integration
- Ideal for electronic devices with compact internal spaces
- Sufficient storage for high-definition video caching, application installation, and system operation
EMMC 5.1 Specification Comparison
| Model | G2864GTLCB | G28128TLCB | G28256TLCB |
|---|---|---|---|
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB |
| CE | 1 | 2 | 4 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.2mm |
Manufacturer: China Chips Star Semiconductor Co., Ltd.




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