| Capacity | 8GB-512GB |
|---|---|
| Read Speed | Up To 330MB/s |
| Agreement | HS400 |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Capacity | 8GB-512GB |
|---|---|
| Agreement | HS400 |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Capacity | 8GB-512GB |
|---|---|
| Read Speed | Up To 330MB/s |
| Agreement | HS400 |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Logo | OEM |
|---|---|
| Error Correction | Built-in ECC (Error Correction Code) |
| Write Speed | Up To 240MB/s |
| Package Type | FBGA |
| Operating Temperature | -40~85℃/-45~105℃ |
| Max Write Speed | 240MB/s |
|---|---|
| Operating Voltage | 3.3V |
| Error Correction | Standard |
| Interface | EMMC 5.1 |
| Operatingtemperature | -45°C To 105°C |
| Capacity | 64GB/128GB/256GB |
|---|---|
| Read Speed | 330MB/s |
| Write Speed | 240MB/s |
| Operating Temperature | -40~85℃/-45~105℃ |
| Dimensions | 11.5mm X 13mm X 1.2mm |
| Name | Industrial Grade EMMC 5.1 |
|---|---|
| Capacity | 64GB / 128GB / 256GB / 512GB |
| Protocol | HS400 |
| Wafer | Industrial Grade KIOXIA Wafer |
| Read Speed | Up To 330MB/s |
| Package Type | FBGA 153 |
|---|---|
| Key Features | Good Quality, High Performance |
| Wafer | Industrial Grade KIOXIA Wafer |
| Voltage | 1.8V And 3.3V |
| Boot Operation | Supports Boot Partition |
| Operating Temperature | -40~85℃/-45~105℃ |
|---|---|
| Logo | OEM |
| Choice Of Flash | MLC/3DTLC/QLC NAND |
| Key Features | Good Quality, High Performance |
| Nand Flash Type | 3D NAND |
| Capacity | 64GB To 256GB |
|---|---|
| Orign | China |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -40℃~+85℃ / -45℃~+105℃ |