| Capacity | 8GB-512GB |
|---|---|
| Read Speed | Up To 330MB/s |
| Agreement | HS400 |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Capacity | 8GB-512GB |
|---|---|
| Agreement | HS400 |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Capacity | 8GB-512GB |
|---|---|
| Read Speed | Up To 330MB/s |
| Agreement | HS400 |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Capacity | 64GB/ 128GB |
|---|---|
| Choice Of Flash | TLC Nand Flash |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -40℃~+85℃/-45℃~+105℃ |
| Package Type | BGA153 |
|---|---|
| Bus Width | 1-bit, 4-bit, 8-bit |
| Productname | EMMC Memory Card |
| Typicalapplications | Smartphones, Tablets, IoT Devices |
| Power Consumption | Typical 50mA Active |
| Appearance | 11.5mmx13mmx1.0mm |
|---|---|
| Write Speed | 240MB/s |
| Capacity | 64GB / 128GB / 256GB / 512GB |
| Oem | OEM |
| Sequential Write Speed | Up To 240 MB/s |
| Package Type | FBGA 153 |
|---|---|
| Key Features | Good Quality, High Performance |
| Wafer | Industrial Grade KIOXIA Wafer |
| Voltage | 1.8V And 3.3V |
| Boot Operation | Supports Boot Partition |
| Operating Temperature | -40~85℃/-45~105℃ |
|---|---|
| Logo | OEM |
| Choice Of Flash | MLC/3DTLC/QLC NAND |
| Key Features | Good Quality, High Performance |
| Nand Flash Type | 3D NAND |
| Warranty Period | 1 Years |
|---|---|
| Memory Density | 64GB/128GB/256GB |
| Form Factor | 153 WFBGA |
| Nandtype | MLC/TLC |
| Voltage | Standard (not Specified) |
| Memory Interface | EMMC5.1 |
|---|---|
| Random Read Iops | Up To 3000 IOPS |
| Form Factor | BGA (Ball Grid Array) |
| Bus Width | 1-bit, 4-bit, 8-bit |
| Nand Type | MLC / TLC |