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EMMC5.1 EMMC Nand Flash Memory Card Chips Embedded Storage Solution

EMMC5.1 EMMC Nand Flash Memory Card Chips Embedded Storage Solution
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Features
Specifications
Capacity: 8GB-512GB
Read Speed: Up To 330MB/s
Agreement: HS400
Write Speed: Up To 240MB/s
Operating Temperature: -25℃~+85℃
Choice Of Flash: MLC/3DTLC/QLC NAND
Product Name: EMMC5.1
Usage: For Automotive, Industrial, And Medical Applications.
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EMMC Nand Flash Memory Card

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EMMC5.1 Nand Flash Memory Card

Basic Infomation
Place of Origin: China
Brand Name: PG
Payment & Shipping Terms
Delivery Time: 7~15days
Product Description

 

eMMC5.1 Memory Storage Chips IC Chips Embedded MultiMedia Card
 
 
  eMMC (embedded MultiMediaCard) is a small device with NAND flash memory and a simple storage controller. eMMC product family provides the ideal embedded storage solution for automotive, industrial, and medical applications.
 
  The embedded MultiMedia Card(eMMC) is the flash memory standard set by the MMC Association for mobile phones and tablets. It is an embedded multimedia memory card packaged into a BGA chip. eMMC is made using parallel transmission technology.
 
  eMMC 5.1 Memory ICs are embedded Flash storage solutions housed in small BGA packages. The ICs are designed for demanding applications and address the need for enhanced reliability. The ICs incorporate onboard error detection and correction, Global wear leveling algorithms, and other data management techniques to provide reliable operation and maximum NAND media life expectancy over the product life cycle.
 
                                   EMMC5.1 EMMC Nand Flash Memory Card Chips Embedded Storage Solution 0
                                   
                              
 
 
 
CA EMMC5.1 Specification
Model G2564GTLCA G25128TLCA G25256TLCA G25512TLCA
NAND Flash 3DTLC NAND 3DTLC NAND 3DTLC NAND 3DTLC NAND
Capacity 64GB 128GB 256GB 512GB
CE 1 2 4 4
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature
-25℃~85℃
-25℃~85℃
-25℃~85℃
-25℃~85℃
EP ≥3000 ≥3000 ≥3000 ≥3000
Packaging Specification BGA 153 BGA 153 BGA 153 BGA 153
Size 11.5mmx13mmx1.0mm 11.5mmx13mmx1.0mm 11.5mmx13mmx1.2mm 11.5mmx13mmx1.2mm

 

 

WHY CHOOSE US?
1.Strong research and development strength
2. Our factory has advanced packaging and testing technology
3. Complete storage product production line
4. Operating our own brand PG focuses on the storage semiconductor field
5. Possess multiple copyright patents
6. High cost-effectiveness, and competitiveness
7.Focus on IC field for more than serval years

 
 
 
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Tel : +8615712055204
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