| Capacity | 8GB-512GB |
|---|---|
| Agreement | HS400 |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Capacity | 8GB-512GB |
|---|---|
| Read Speed | Up To 330MB/s |
| Agreement | HS400 |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -25℃~+85℃ |
| Package Type | BGA153 |
|---|---|
| Bus Width | 1-bit, 4-bit, 8-bit |
| Productname | EMMC Memory Card |
| Typicalapplications | Smartphones, Tablets, IoT Devices |
| Power Consumption | Typical 50mA Active |
| Flash Technology | 3D NAND |
|---|---|
| Applications | Smartphones, Tablets, IoT Devices, Embedded Systems |
| Write Speed | Up To 240MB/s |
| Mounting Type | Standard |
| Productname | EMMC Memory Card |
| Warranty | 1years |
|---|---|
| Product Completion | Standard |
| Mtbf (Mean Time Between Failures) | 1 Million Hours |
| Choice Of Flash | 3DTLC |
| Length | 13mm |
| Max Write Speed | 240MB/s |
|---|---|
| Operating Voltage | 3.3V |
| Error Correction | Standard |
| Interface | EMMC 5.1 |
| Operatingtemperature | -45°C To 105°C |
| Length | 13mm |
|---|---|
| Random Write Speed | Up To 4,000 IOPS |
| Sequential Read Speed | Up To 400MB/s |
| Formfactor | BGA153 |
| Product Completion | Standard |
| Warranty Period | 1 Years |
|---|---|
| Memory Density | 64GB/128GB/256GB |
| Form Factor | 153 WFBGA |
| Nandtype | MLC/TLC |
| Voltage | Standard (not Specified) |
| Memory Interface | EMMC5.1 |
|---|---|
| Random Read Iops | Up To 3000 IOPS |
| Form Factor | BGA (Ball Grid Array) |
| Bus Width | 1-bit, 4-bit, 8-bit |
| Nand Type | MLC / TLC |
| Nand Flash | TLC/QLC |
|---|---|
| Series | Libre |
| Max Write Speed | 240MB/s |
| Wear Leveling | Supported |
| Read Speed | Up To 330MB/s |