High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable
Product Summary
Product Details
pSLC eMMC Module
,High Endurance pSLC Technology
,Smart Wearable Memory Solution
Product Description
The High Endurance pSLC eMMC Module with 153 Ball FBGA Package is a high-reliability embedded storage solution designed for smart wearables, IoT devices, medical wearable equipment, industrial terminals, and edge AI applications.
Based on eMMC 5.1 interface technology, this module integrates NAND Flash and an intelligent controller with advanced LDPC ECC error correction, wear leveling, bad block management, and optimized firmware algorithms. The pSLC mode enhances endurance and data reliability compared with traditional TLC NAND, making it suitable for devices requiring frequent data writing, long operating cycles, and stable performance.
| Parameter | Specification |
|---|---|
| Product Type | Embedded Multimedia Card (eMMC IC Chip) |
| Application | Smart Wearable / Smart Display |
| Capacity | 4GB / 8GB / 16GB / 32GB / 64GB |
| Interface | eMMC 5.1 |
| NAND Flash Type | 3D NAND Flash |
| Package | BGA153 |
| Error Correction | LDPC ECC |
| Operating Voltage | 1.8V / 3.3V |
| Performance Mode | HS400 Supported |
| Data Protection | ECC, Wear Leveling, Bad Block Management |
| Operating Temperature | Commercial: 0°C to 70°C / Industrial Option: -25°C to 85°C |
| Storage Temperature | -25°C to 85°C |
| Form Factor | Embedded IC Package 153 |
| Application Life Cycle | Long-term Supply Support |
China Chips Star Semiconductor specializes in:
- eMMC 5.1 storage solutions
- Industrial memory cards
- Automotive-grade storage
- NAND Flash storage products
With dedicated R&D and testing capabilities, China Chips Star provides customized embedded storage solutions for global customers.
China Chips Star develops storage solutions based on advanced NAND management technologies:
- pSLC mode optimization
- LDPC ECC algorithm
- Flash lifetime management
- Firmware optimization
Providing higher reliability for write-intensive applications.
