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High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 

50pcs
MOQ
Negotiable
Price
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 
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Features
Specifications
Protocol: HS400
Packeage Type: 153BGA
Manufacturer: NUW Brand，China Chips Star
Chip: Hynix V7
Aplication: Smart Wearable
Error Correction: Built-in ECC (Error Correction Code)
Write Speed: 240MB/S
Material: Plastic
Condition: New
Sequential Write Speed: Up To 240 MB/s
Highlight:

pSLC eMMC Module

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High Endurance pSLC Technology

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Smart Wearable Memory Solution
Basic Infomation
Place of Origin: Shenzhen, China
Brand Name: PG
Payment & Shipping Terms
Delivery Time: 3 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month
Product Description
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable

The High Endurance pSLC eMMC Module with 153 Ball FBGA Package is a high-reliability embedded storage solution designed for smart wearables, IoT devices, medical wearable equipment, industrial terminals, and edge AI applications.

Based on eMMC 5.1 interface technology, this module integrates NAND Flash and an intelligent controller with advanced LDPC ECC error correction, wear leveling, bad block management, and optimized firmware algorithms. The pSLC mode enhances endurance and data reliability compared with traditional TLC NAND, making it suitable for devices requiring frequent data writing, long operating cycles, and stable performance.

Embedded eMMC 5.1 Specifications
Parameter Specification
Product Type Embedded Multimedia Card (eMMC IC Chip)
Application Smart Wearable / Smart Display
Capacity 4GB / 8GB / 16GB / 32GB / 64GB
Interface eMMC 5.1
NAND Flash Type 3D NAND Flash
Package BGA153
Error Correction LDPC ECC
Operating Voltage 1.8V / 3.3V
Performance Mode HS400 Supported
Data Protection ECC, Wear Leveling, Bad Block Management
Operating Temperature Commercial: 0°C to 70°C / Industrial Option: -25°C to 85°C
Storage Temperature -25°C to 85°C
Form Factor Embedded IC Package 153
Application Life Cycle Long-term Supply Support
Why Choose China Chips Star?
Professional Embedded Storage Manufacturer

China Chips Star Semiconductor specializes in:

  • eMMC 5.1 storage solutions
  • Industrial memory cards
  • Automotive-grade storage
  • NAND Flash storage products

With dedicated R&D and testing capabilities, China Chips Star provides customized embedded storage solutions for global customers.

High-Endurance Storage Technology

China Chips Star develops storage solutions based on advanced NAND management technologies:

  • pSLC mode optimization
  • LDPC ECC algorithm
  • Flash lifetime management
  • Firmware optimization

Providing higher reliability for write-intensive applications.

Product Images
eMMC IC Chip close-up view showing BGA package and component details

eMMC IC Chip mounted on PCB board for digital advertising applications

eMMC storage module technical specifications and labeling

eMMC IC Chip packaging and industrial application context

Tag:

Embedded eMMC5.1

eMMC BGA153

Memory Chip IC eMMC

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