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Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

50pcs
MOQ
Negotiable
Price
Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component
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Features
Specifications
Product Name: Automotive Embedded Multi Media Card
Logo Customized Service: Available
Material: Plastic
Capacity Options: 64GB, 128GB, 256GB
Origin: China
Package: BGA153 Package
Quality: Good
Read Speed: 330MB/s
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Basic Infomation
Place of Origin: China
Brand Name: PG
Payment & Shipping Terms
Delivery Time: 10 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month
Product Description
Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component
Automotive-grade eMMC is an embedded non-volatile memory chip specifically engineered for the demanding environments of automotive electronics. Utilizing the BGA 153 package, this solution integrates NAND flash, controller, and MMC interface into a single chip, fully compliant with automotive standards including AEC-Q100. With core advantages of high reliability, wide temperature resistance, extended durability, and robust protection, it serves as a critical storage solution for multiple applications in intelligent vehicles.
Technical Specifications
Interface eMMC 5.1 with HS400 support
Capacities 64GB, 128GB, 256GB
Data Transfer Speed Up to 400MB/s (HS400 mode)
Operating Voltage 3.3V (VCC), 1.8V/3.3V (VCCQ)
Temperature Range -40°C to 105°C
Endurance High endurance for frequent read/write cycles
Security RPMB, secure boot, and write protection
Package BGA (Ball Grid Array)
Package Size 11.5 x 13 x 1 mm
Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component 0 Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component 1 Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component 2 Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component 3
Core Technologies and Reliability Design
Automotive Certification and Wide Temperature Adaptation
Complies with AEC-Q100 Grade2 (-40℃~105℃) and adapts to temperature variations across automotive environments including engine compartments and cockpits. Certified with IATF16949 quality management standards.
Performance and Power Consumption Optimization
Adheres to JEDEC eMMC 5.1 protocol with HS400 high-speed mode support, delivering sequential read/write speeds up to 330/240MB/s. Features intelligent low-power algorithms and FBA acceleration technology to balance high performance with efficient power consumption.
Packaging and Adaptability
Utilizes 153-ball FBGA package (11.5×13×1mm dimensions). The on-board soldering method enhances vibration resistance, enabling adaptation to the limited space and impact resistance requirements of automotive electronics. Available in capacities ranging from 64GB to 256GB.
Tag:

eMMC5.1

Automotive Embedded eMMC

Flash Memory IC Chip

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