Automotive Grade eMMC5.1 BGA153 Package Memory IC HS400 for ADAS 64GB 128GB 256GB
Overview of PG Brand Automotive Grade eMMC5.1
The eMMC 5.1 embedded memory solution delivers exceptional performance, reliability, and scalability for modern devices. This high-speed storage solution combines robust endurance with compact form factors, making it ideal for smartphones, tablets, IoT devices, automotive systems, and industrial applications.
Key Features of Automotive Grade eMMC5.1
- Blazing Fast Speeds: Supports eMMC 5.1 standard with HS400 mode for data transfer speeds up to 400MB/s, enhancing system performance and reducing boot times
- High-Capacity Options: Available in capacities from 64GB to 256GB to meet diverse storage requirements
- Enhanced Reliability: Advanced NAND flash technology with wear leveling, bad block management, and error correction for data integrity
- Low Power Consumption: Optimized power efficiency extends battery life in portable and IoT devices
- Compact Design: Integrated flash memory and controller in single BGA package reduces PCB space requirements
- Wide Temperature Range: Industrial-grade operation from -45°C to 105°C with extended options for automotive applications
- Advanced Security: Built-in RPMB (Replay Protected Memory Block) for secure data storage and authentication
Applications of PG Brand Automotive Grade eMMC5.1
Mobile Devices: Smartphones, tablets, and wearables
Automotive: Infotainment systems, ADAS, and telematics
IoT: Smart home devices, industrial sensors, and connected appliances
Industrial: Robotics, automation, and embedded systems
Consumer Electronics: Digital cameras, gaming consoles, and set-top boxes
Technical Specifications of PG Brand Automotive Grade eMMC5.1
| Parameter |
Details |
| Interface |
eMMC 5.1 with HS400 support |
| Capacities |
64GB, 128GB, 256GB |
| Data Transfer Speed |
Up to 400MB/s (HS400 mode) |
| Operating Voltage |
3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Temperature Range |
-45°C to 105°C |
| Endurance |
High endurance for frequent read/write cycles |
| Security |
RPMB, secure boot, and write protection |
| Package |
BGA 153 (Ball Grid Array) |
| Package Size |
11.5 x 13 x 1 mm |
Pictures of China Chips Star Semiconductor Co., Ltd
Why Choose Automotive Grade eMMC5.1?
Cost-Effective: Integrated NAND flash and controller reduces BOM costs
Ease of Integration: Standardized interface simplifies design and development
Future-Proof: Supports latest eMMC standards for next-generation device compatibility
Support and Resources
Datasheets: Detailed technical specifications
Design Guides: Integration guidelines and best practices
Technical Support: Expert assistance for your design requirements
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