EMMC 5.1 Memory IC with HS400 High-Speed Transmission Full Capacity 4GB-256GB and Low-Power Energy-Saving Design for Smart Devices

Complying strictly with the JEDEC eMMC 5.1 industry standard, this product supports the HS400 high-speed transmission mode with a theoretical peak transmission rate of 400MB/s. It achieves maximum measured sequential read speeds of 330MB/s and sequential write speeds of 290MB/s, efficiently meeting the high-frequency data read-write demands of terminal devices.

• Enables rapid APP installation and high-definition video loading
• Supports large-scale game operation without stuttering
• Eliminates device loading delays and improves operation fluency
• Well adapted to lightweight and high-frequency workloads of civilian terminals

The product covers a complete capacity range from 4GB to 256GB, including entry-level small-capacity and high-end large-capacity versions.

• Small-capacity versions meet basic system storage and lightweight application installation needs
• Large-capacity versions support high-definition audio and video storage
• Enables multi-program background operation and mass storage of photos and videos
• Precisely matches smartphones, tablets, smart wearable devices, and home set-top boxes

Equipped with an intelligent power consumption regulation algorithm that supports automatic sleep and dynamic frequency modulation functions.

• Automatically reduces power consumption in standby mode
• Adjusts performance-power consumption ratio on demand during operation
• Significantly reduces power loss compared to traditional storage chips
• Effectively extends battery life of handheld mobile devices
• Avoids power overload and overheating stuttering during high-frequency operation

Adopts standard FBGA-153 ball grid array packaging with a compact size of 11.5mm×13mm and high integration.

• Does not require complex additional peripheral circuits
• Simplifies hardware design structure of terminal devices
• Perfectly conforms to slim and miniaturized design trends
• Saves internal device space while ensuring stable storage performance
• Suitable for assembly of various portable civilian smart terminals