Wide Temperature eMMC 5.1 BGA153 128GB 64GB Industrial Flash Memory Chip
Product Summary
Product Details
Wide Temperature eMMC 5.1
,Industrial Flash Memory
,BGA153 Embedded Storage
Product Description
Wide Temperature eMMC 5.1 BGA153 128GB 64GB Industrial Flash Memory Chip
Outdoor cabinets, roadside equipment and factory floors expose electronics to conditions no office product ever sees. A storage device rated only for comfortable room temperature can lose data or refuse to boot when the enclosure heats up under summer sun or freezes on a winter night. Wide temperature eMMC 5.1 is screened and specified to hold data and function across a demanding industrial profile.
The part keeps the eMMC 5.1 HS400 interface, BGA153 package and 128GB to 64GB capacities that mainstream designs already use, so the change from a commercial part is a change in grade rather than in layout. LDPC ECC and wear levelling continue to protect data as the device ages, even where temperature swings accelerate wear.
Field failures in outdoor equipment are often traced to storage that was specified at room temperature. Choosing a part screened for the industrial profile removes that risk at the design stage, before cabinets are deployed to remote sites where a service call is expensive. Test data covering endurance and retention supports the decision and gives quality teams a document to file.
Industrial Temperature Specifications
| Interface | eMMC 5.1, HS400 mode |
| Capacity | 32GB / 64GB / 128GB |
| NAND Flash | 3D TLC NAND (pSLC option) |
| Error Correction | LDPC ECC |
| Wear Levelling | Static and dynamic |
| Operating Voltage | VCC 3.3V, VCCQ 1.8V / 3.3V |
| Operating Temperature | -40C to +105C |
| Package | BGA153, 11.5 x 13 x 1.0mm |
| Boot & RPMB | Standard eMMC 5.1 boot partition with RPMB |
| Compliance | JEDEC eMMC 5.1, RoHS |
| Temperature Grade | Extended industrial profile for harsher enclosures |
| Use Case | Outdoor cabinets, roadside units, factory equipment |
Available Models
| Model | Capacity | NAND | Package | Dimensions |
|---|---|---|---|---|
| G2832GTLIH | 32GB | 3D TLC | FBGA153 | 11.5*13mm |
| G2864GTLIH | 64GB | 3D TLC | FBGA153 | 11.5*13mm |
| G28128TLIH | 128GB | 3D TLC | FBGA153 | 11.5*13mm |
Advantages In Harsh Environments
- Extended temperature profile keeps the device working across hot and cold extremes.
- Data retention maintained through seasonal temperature swings in outdoor cabinets.
- LDPC ECC corrects errors that become more likely at temperature extremes.
- Wear levelling protects hot logging partitions throughout the operating life.
- Standard eMMC 5.1 HS400 interface avoids host software changes.
- BGA153 footprint supports a direct upgrade from commercial grade parts.
Wide Temperature eMMC Questions
Why does temperature matter for embedded storage?
Read, write and retention margins shrink at temperature extremes. A wide temperature part is screened so it keeps functioning and holding data in cold and hot conditions rather than only at room temperature.
Where is a wide temperature part needed?
It fits outdoor cabinets, roadside equipment, factory automation and any enclosure exposed to sun, frost or process heat.
Does it use the same interface?
Yes. The device keeps the eMMC 5.1 HS400 interface and BGA153 package, so it drops into existing industrial boards.
How do ECC and temperature interact?
Error rates rise as cells age and at temperature extremes, so the LDPC ECC engine works harder to keep the corrected data reliable.
Which capacities are available?
The industrial range covers 128GB and 64GB in the same 11.5 x 13 x 1.0mm footprint.
PG supplies embedded flash from Shenzhen with CE, RoHS, ISO9001, AEC-Q100 and IATF16949 certified production. Temperature and endurance test data are available for your qualification.
