Dual Voltage 1.8V 3.3V eMMC 5.1 32GB 64GB 128GB Embedded Flash Wide Compatibility
Product Summary
Product Details
Dual Voltage eMMC 5.1
,1.8V 3.3V Embedded Flash
,128GB eMMC5.1
Product Description
Different host platforms use different I/O voltage domains, and an eMMC that only supports one voltage can force costly level shifting or board redesign. This PG eMMC 5.1 supports dual voltage operation with VCC at 3.3V and VCCQ at 1.8V, covering the two most common power rails in embedded designs. That flexibility simplifies the BOM and lets one memory part serve multiple products in a portfolio.
Available in 32GB, 64GB and 128GB densities, the device is compliant with the JEDEC eMMC 5.1 specification and supports HS400 mode in both voltage configurations. Design teams can qualify one part and reuse it across set top boxes, tablets, IoT gateways, industrial boards and consumer electronics that run on different voltage domains.
Dual voltage support does not compromise reliability: the device still includes LDPC ECC, wear leveling, bad block management and wide temperature operation. The BGA153 package keeps the footprint standard, so the same board layout works across the capacity and voltage range.
| Model | Capacity | Protocol Standards | NAND | Package | Dimensions | Operating Temperature | Storage Temperature |
|---|---|---|---|---|---|---|---|
| G2864GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28128TLCB | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G28256TLCB | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2819GPLCB | 19GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~105℃ |
| G2508GTLCB | 8GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2516GTLCB | 16GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2532GTLCB | 32GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2564GTLCB | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -0℃~70℃ | -45℃~85℃ |
| G2504GPLCB | 4GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2508GPLCB | 8GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| G2516GPLCB | 16GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -25℃~85℃ | -40℃~85℃ |
| Interface | eMMC 5.1, HS400 mode |
| Capacity | 32GB / 64GB / 128GB |
| Operating Voltage | VCC 3.3V, VCCQ 1.8V |
| NAND Flash | 3D TLC NAND |
| Sequential Read | Up to 300MB/s |
| Sequential Write | Up to 220MB/s |
| Operating Temperature | -25C to +85C |
| Package | BGA153, 11.5 x 13 x 1.0mm |
- Supports both 3.3V and 1.8V I/O domains for broad host compatibility
- One qualified part can be reused across multiple product platforms
- Simplifies BOM and reduces the need for voltage level shifting
- Full eMMC 5.1 HS400 performance in both voltage configurations
- Ideal for set top boxes, tablets, IoT gateways and industrial boards
- Standard BGA153 footprint for layout reuse across capacities
Design teams often maintain separate BOMs for platforms with different voltage domains, multiplying qualification effort and inventory cost. This dual voltage eMMC 5.1 collapses that complexity: the same part operates at 3.3V VCC and 1.8V VCCQ, so a single qualification covers set top boxes, tablets, gateways and industrial boards across the product line.
Dual voltage support is implemented without compromising performance or reliability. HS400 speed, LDPC ECC, wear leveling and wide temperature operation are all available in both voltage configurations, and the BGA153 package means the board layout is identical across capacities. Fewer part numbers, simpler logistics and faster time to market: that is the value of this dual voltage eMMC 5.1.
The dual voltage eMMC 5.1 simplifies inventory because one 32GB, 64GB or 128GB part number serves platforms running on either 1.8V or 3.3V I/O, reducing qualification cost and stock keeping units across the product family.
