Our eMMC 5.1 embedded memory chips offer comprehensive capacity options from 4GB, 8GB, 16GB (PSLC) to 32GB, and 64GB (TLC). These advanced chips integrate 3D NAND flash particles with a high-performance built-in controller in a compact 153-ball FBGA package, simplifying peripheral circuit design and enabling efficient mass mounting.
Combining PSLC high-reliability mode with TLC high-capacity advantages, this product line delivers optimal balance between ultra-stable performance, low power consumption, and cost-effectiveness. These chips serve as the ideal embedded storage solution for Android smart devices, smart displays, IoT terminals, and consumer electronic products.
With optimized firmware algorithms and advanced hardware error correction mechanisms, these eMMC chips provide consistent read/write speeds, excellent anti-interference capability, and long-term operational stability. They support mainstream high-speed transmission modes and adaptive power management, perfectly adapting to the continuous operation and frequent data read-write demands of smart terminal devices.
| Parameter | eMMC Solution |
|---|---|
| Product Type | eMMC 5.1 |
| Capacity Range | 4GB-64GB |
| Interface | eMMC 5.1 HS400 |
| NAND Type | TLC / PSLC |
| Operating Temperature | 0°C to 70°C |
| Error Correction | LDPC ECC |
| Reliability Technology | Wear Leveling, Bad Block Management |
| Package | BGA153 |
| Application Level | Smart Equipment |
This full-series eMMC 5.1 BGA153 memory chips are widely applicable to various embedded smart terminal products, covering both consumer and industrial scenarios:
