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BGA Original New 32/64G EMMC Memory Chip IC Electronic Components eMMC Factory

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BGA Original New 32/64G EMMC Memory Chip IC Electronic Components eMMC Factory
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Eigenschaften
Technische Daten
Produktname: Ursprüngliches neues EMMC
Kapazität: Normalerweise zwischen 64 GB und 256 GB
Besonderheit: Niedrig
Garantie: 1 Jahr
NAND-FLASH: TLC
Aufeinander folgend schreiben Sie Geschwindigkeit: Bis zu 240 MB/s
Aussehen: 11,5 mm x 13 mm x 1,0 mm
Protokoll: HS400
Grundinformation
Herkunftsort: Shenzhen, China
Markenname: PG
Modellnummer: G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB
Zahlung und Versand AGB
Lieferzeit: 10 bis 15 Tage
Zahlungsbedingungen: L/C, T/T
Versorgungsmaterial-Fähigkeit: 100k pro Monat
Produkt-Beschreibung
BGA Original New 32/64G EMMC Memory Chip IC Electronic Components eMMC Factory
As a highly integrated and stable memory chip, eMMC is widely used in various products such as smart Bluetooth speakers, WiFi voice speakers and car audio speakers. The large-capacity 32GB / 64GB eMMC chips in BGA package can perfectly meet the core requirements of smart speakers for system operation, audio storage, voice interaction, offline caching and so on, making them key electronic components for smart audio devices.
Key Features of EMMC Chips

1.Main Applications of eMMC in Smart Speakers
System Firmware & Operating System Storage
Stores the boot program, drivers, and operating system of the speaker’s main control chip.
Ensures fast startup and stable operation, preventing program loss or abnormal booting.
Supports OTA system updates for convenient later function iteration and bug fixes.


2. Large-Capacity Local Audio File Storage
32G/64G large capacity can store thousands of high-quality music tracks, audiobooks, children’s songs, white noise, and more.
Enables offline playback without relying on a network, improving user experience.
Compared with TF cards, eMMC uses an on-board BGA package, which is shockproof, loose-proof, and more stable.


3.Local Caching for Voice Assistants & AI Algorithms
Stores voice wake-up models and offline speech recognition lexicons.
Caches conversation logs and frequently used commands for faster response and usability under weak network conditions.
Works with DSP for audio data processing, enhancing radio reception, noise reduction, and human voice recognition performance.

EMMC 5.1 Specification Comparison
Model G2864GTLCB G28128TLCB G28256TLCB
NAND Flash 3DTLC NAND 3DTLC NAND 3DTLC NAND
Capacity 64GB 128GB 256GB
CE 1 2 4
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature -25℃~85℃ -25℃~85℃ -25℃~85℃
EP ≥3000 ≥3000 ≥3000
Packaging Specification BGA 153 BGA 153 BGA 153
Size 11.5mm×13mm×1.0mm 11.5mm×13mm×1.0mm 11.5mm×13mm×1.2mm
Manufacturer: China Chips Star Semiconductor Co., Ltd.
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Bewertungen & Überprüfung

Gesamtbewertung

5.0
Basierend auf 50 Bewertungen für diesen Lieferanten

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Alle Bewertungen

A
Ahmal
Indonesia Feb 12.2026
I tested them and they work normally.
R
R*n
Russian Federation Sep 3.2025
It's a very good product, the seller is very attentive and prompt, very satisfied.
E
Eyob
Netherlands Jun 12.2025
I have well test my memory cards received, (64 gb 128 gb) their quality is perfect.
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