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Quality eMMC 5.1 Embedded Memory IC 32GB 64GB TLC NAND Flash HS400 BGA153 for Notebook Tablet factory
Quality eMMC 5.1 Embedded Memory IC 32GB 64GB TLC NAND Flash HS400 BGA153 for Notebook Tablet factory
Quality eMMC 5.1 Embedded Memory IC 32GB 64GB TLC NAND Flash HS400 BGA153 for Notebook Tablet factory
Quality eMMC 5.1 Embedded Memory IC 32GB 64GB TLC NAND Flash HS400 BGA153 for Notebook Tablet factory
Quality eMMC 5.1 Embedded Memory IC 32GB 64GB TLC NAND Flash HS400 BGA153 for Notebook Tablet factory

eMMC 5.1 Embedded Memory IC 32GB 64GB TLC NAND Flash HS400 BGA153 for Notebook Tablet

Product Specification
Place of Origin: China
Brand Name: PG
Certification: ISO9001, RoHS
Model Number: eMMC 5.1 with HS400 support
Minimum Order Quantity: 50 Pieces
Price: USD 3-8 / Piece
Standard Packaging: Anti-static vacuum tray with moisture barrier bag, export-grade carton
Delivery Time: 3 to 5 days
Payment Terms: L/C,T/T
Supply Ability: 100K Pieces per Month

Product Summary

32GB/64GB eMMC 5.1 embedded memory IC with TLC NAND flash, HS400 interface up to 400MB/s, and compact BGA153 package for laptops, tablets and smart devices.

Product Details

Highlight:

TLC NAND Flash Storage

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HS400 400MB/s Transfer Speed

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BGA153 Embedded Memory IC

Condition: New
Nand Flash: TLC
Interface: HS400, HS200, HS, DDR
Operating Temperature: 0°C To +70°C
Package: BGA153
Package Size: 11.5 X 13 X 1 Mm
Operating Voltage: 3.3V (VCC), 1.8V/3.3V (VCCQ)
Data Transfer Speed: Up To 400MB/s
Security: RPMB, Secure Boot, Write Protection
Capacities: 32GB, 64GB

Product Description

eMMC 5.1 Embedded Memory IC 32GB 64GB TLC NAND Flash HS400 BGA153 for Notebook Tablet
Our eMMC 5.1 embedded memory ICs are available in 32GB and 64GB TLC NAND flash configurations, engineered for high-performance notebook and tablet applications. Each chip integrates advanced 3D NAND flash with a high-speed onboard controller inside a compact BGA153 package, delivering a dependable storage core for space-constrained designs.
The integrated architecture simplifies peripheral circuit design and accelerates mass production mounting, combining generous storage capacity with balanced performance and competitive cost. These chips are the ideal embedded storage solution for Android smart devices, smart displays, IoT terminals, and consumer electronics.
With optimized firmware algorithms and sophisticated hardware error correction, these eMMC chips sustain consistent read and write speeds, outstanding anti-interference performance, and long-term reliability. Supporting mainstream high-speed transmission modes and adaptive power management, they are well suited for smart terminals that demand continuous operation and frequent data access.
Key Features
  • High Speed Performance: Supports eMMC 5.1 HS400 interface with transfer speeds up to 400MB/s, shortening boot time and boosting device responsiveness
  • Flexible Capacities: Available in 32GB and 64GB to cover the standard storage needs of consumer devices
  • Data Reliability: Built-in wear leveling, bad block management, and ECC guarantee data integrity over extended usage
  • Energy Efficient: Low-power design extends the continuous working time of portable equipment
  • Space Saving Design: Integrated BGA153 package effectively minimizes PCB layout footprint
  • Operating Temperature: Stable operation from 0°C to 70°C for consumer electronic applications
  • Security Features: Embedded RPMB for secure data storage and information protection
Applications
Ideal for notebooks, tablets, smart devices, household electronics, portable gadgets, and commercial terminals.
eMMC 5.1 Memory IC product image showing chip design and packaging eMMC 5.1 Memory IC technical diagram and specifications
Technical Specifications
Parameter Details
Interface eMMC 5.1 with HS400 support
Available Capacities 32GB, 64GB
NAND Type TLC 3D NAND flash
Data Transfer Speed Up to 400MB/s (HS400 mode)
Operating Voltage 3.3V (VCC), 1.8V/3.3V (VCCQ)
Endurance High endurance for frequent read/write cycles
Security RPMB, secure boot, and write protection
Operating Temperature 0°C to 70°C
Package Size 11.5 x 13 x 1 mm
Package BGA 153 (Ball Grid Array)
Why Choose Our eMMC 5.1 Embedded Memory
  • Cost Effective Storage: Integrated TLC NAND flash and built-in controller lower overall BOM cost, making it ideal for mass production of consumer electronic devices
  • Reliable Daily Performance: Stable operation within 0°C to 70°C delivers consistent performance for regular indoor consumer electronics scenarios
  • Easy Integration: Fully compliant with the eMMC 5.1 standard interface, simplifying design and shortening time to market for embedded systems
  • Practical Storage Options: Offered in 32GB and 64GB capacities to precisely meet the mainstream storage requirements of lightweight smart devices
  • Optimized for Portable Electronics: Combining low power consumption and the compact BGA153 package, it is an excellent choice for space-limited, battery-powered terminals
Support and Resources
  • Datasheets: Full technical specifications covering electrical characteristics and performance parameters under 0°C to 70°C operating temperature
  • Design Guides: Complete integration guidelines and best practices for consumer embedded storage projects
  • Technical Support: Professional technical support for product design and performance verification
Contact Us
Planning to deploy our 32GB or 64GB eMMC 5.1 TLC embedded memory ICs in your next project? Contact our sales team for quotations, sample evaluation, and customized solutions.
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