logo
×
Quality High-speed eMMC5.1 Flash Memory Chip with 16GB 8GB 4GB Capacity and Wide Temperature Range for Embedded Storage factory
Quality High-speed eMMC5.1 Flash Memory Chip with 16GB 8GB 4GB Capacity and Wide Temperature Range for Embedded Storage factory
Quality High-speed eMMC5.1 Flash Memory Chip with 16GB 8GB 4GB Capacity and Wide Temperature Range for Embedded Storage factory

High-speed eMMC5.1 Flash Memory Chip with 16GB 8GB 4GB Capacity and Wide Temperature Range for Embedded Storage

Product Specification
Place of Origin: Shenzhen, China
Brand Name: NUW
Model Number: G2504GPLCB/G2508GPLCB/G2516GPLCB
Minimum Order Quantity: 50pcs
Price: Negotiable
Delivery Time: 10 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month

Product Summary

eMMC5.1 8GB 16GB 4GB High-speed Flash Memory Wide Temperature Embedded Storage Chip Highly Integrated Architecture eMMC (Embedded Multi-Media Card) adopts an integrated BGA packaging design, integrating high-density NAND Flash memory chips and a dedicated flash controller into a single chip. No ...

Product Details

Highlight:

PSLC

,

eMMC5.1

,

Embedded Chip

Write Speed: 240MB/s
Protocol: HS400
Warranty: 1 Year
Manufacturer: PG Brand,China Chips Star
Product: EMMC
Storage Apacity: 16GB 8GB 4GB
Quality: 100% Original
Key Features: Embedded EMMC

Product Description

eMMC5.1 8GB 16GB 4GB High-speed Flash Memory Wide Temperature Embedded Storage Chip
Highly Integrated Architecture

eMMC (Embedded Multi-Media Card) adopts an integrated BGA packaging design, integrating high-density NAND Flash memory chips and a dedicated flash controller into a single chip. No additional control modules are required, which greatly simplifies the design of terminal product storage solutions.

Its unified MMC standard interface effectively shields the process differences and compatibility issues of NAND Flash from different brands. Terminal manufacturers do not need to invest energy in handling complex technical problems such as bad block management and ECC verification. They can directly select eMMC chips with appropriate capacities, significantly shortening the R&D cycle of new products, reducing R&D costs, and accelerating the product launch rhythm.

The compact packaging size can save more motherboard space for small devices such as mobile phones, tablets, and smart wearables, adapting to various thin and light design needs.

eMMC memory chip integrated architecture diagram
Technical Specifications of PSLC eMMC 5.1
Model G2504GPLCB G2508GPLCB G2516GPLCB
NAND Flash PSLC PSLC PSLC
Capacity 4GB 8GB 16GB
Warranty 1 Year 1 Year 1 Year
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature 0℃~70℃ 0℃~70℃ 0℃~70℃
EP ≥10000 ≥10000 ≥10000
Packaging Specification BGA 153 BGA 153 BGA 153
Size 11.5mm×13mm×1.0mm 11.5mm×13mm×1.0mm 11.5mm×13mm×1.0mm
Production Line
Exhibition
You May Also Like