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New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits Electronic Components IC Chip Ic

100pcs
MOQ
Negotiable
Price
New Original 64G 128G 256G BGA153 EMMC 5.1 Flash Memory Integrated Circuits Electronic Components IC Chip Ic
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Features
Specifications
Product Name: EMMC 5.1 Flash Memory
Operating Temperature: -25°C To 85°C
Choice Of Flash: MLC / 3D TLC / QLC NAND
Capacity: Up To 256GB
Read Speed: Up To 330MB/S
Oem: Welcome
Wafer: KIOXIA
Warranty: 1 Years
Highlight:

High Speed Flash Memory Disk

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USB Flash Memory Disk

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High Speed 512GB USB Flash Drive

Basic Infomation
Place of Origin: China
Brand Name: PG
Payment & Shipping Terms
Delivery Time: 10 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month
Product Description
BGA153 eMMC 5.1 Flash Memory IC Chips
New Original 64GB, 128GB, and 256GB BGA153 eMMC 5.1 Flash Memory Integrated Circuits - essential electronic components for smart speaker applications and embedded systems.
eMMC (Embedded Multimedia Card) delivers high integration, exceptional stability, reliability, and cost-effective performance, making it a core storage component in smart speaker hardware solutions. These chips handle critical functions including firmware storage, data caching, and operational support.
Technical Specifications
Model G2864GTLCA / G28128GTLCA / G28256GTLCA
Capacity 64GB / 128GB / 256GB
Controller SMI
Wafer KIOXIA
Package Type BGA153
Read Speed 330 MB/s
Write Speed 240 MB/s
Competitive Advantages for Smart Speaker Applications
Customized Capacity Solutions
Multiple capacity options from 64GB to 256GB to meet diverse smart speaker price points and performance requirements.
Optimized Power Efficiency
Advanced controller algorithms minimize standby power consumption, enhancing device stability when integrated with smart speaker power management systems.
Broad Platform Compatibility
Compatible with mainstream chip platforms including MediaTek, Rockchip, Quanzhi, and other common smart speaker processors. Comprehensive driver support accelerates product development cycles.
Core Requirements for Smart Speaker eMMC
  • Low Power Adaptation: Supports sleep and power-saving modes to minimize energy consumption during standby, maintaining wake-up functionality while reducing overall power usage.
  • Stable Read/Write Performance: Fast sequential read/write speeds ensure quick firmware loading and large file processing. Random read/write capabilities enable rapid voice command parsing and response.
  • High Reliability & Durability: Engineered for continuous 24/7 operation, capable of withstanding prolonged high-frequency read/write cycles from logging, updates, and system operations.
  • Compact Size & High Integration: BGA packaging integrates flash memory and controllers into a single chip, eliminating additional control circuits and optimizing PCB space for compact smart speaker designs.
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Get in touch with us
Contact Person : Ms. Sunny Wu
Tel : +8615712055204
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