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eMMC5.1 Commercial Grade Flash Storage Chip with High Read Write Speed and Low Power Consumption

50 pezzi
MOQ
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eMMC5.1 Commercial Grade Flash Storage Chip with High Read Write Speed and Low Power Consumption
Caratteristiche Galleria Descrizione di prodotto Richieda una citazione
Caratteristiche
Specificazioni
costume: Supporto
Tipo di pacchetto: BGA (Griglia di sfere)
partizionamento: Supporta più partizioni tra cui RPMB, partizioni GP
Compatibilità: Smartphone
Larghezza del bus: 8 bit
Temperatura di lavoro: -25~85℃
Tipo Nand Flash: 3D NAND
Caratteristiche chiave: Buona qualità, elevate prestazioni
Funzione: Memoria
Voltaggio: 1,8 V/3,3 V
Evidenziare:

IOT device embedded eMMC flash

,

High reliability wide temp eMMC

,

Embedded system original eMMC

Informazioni di base
Luogo di origine: Shenzen, Cina
Marca: PG
Numero di modello: G28128TLCB/G28256TLCB/G2864GTLCB
Termini di pagamento e spedizione
Tempi di consegna: 10-15 giorni
Termini di pagamento: L/C, T/T
Capacità di alimentazione: 100k al mese
Descrizione di prodotto
eMMC5.1 Commercial Grade EMMC Flash Storage Chip High Read Write Speed Embedded Memory Module
Product Overview

eMMC5.1 Mini Compact EMMC Flash IC Low Power Consumption For Mobile Portable Devices

Key Features
1. JEDEC Compliant eMMC 5.1 High-Speed Interface

Fully compliant with JEDEC industry standards and equipped with HS400 high-speed transmission mode, delivering a maximum sequential read speed of 230MB/s. It enables smooth system boot-up for smart TVs, tablets and OTT set-top boxes, and backward-compatible with legacy motherboards supporting eMMC 4.5 & 5.0 for direct hardware replacement without circuit modification.

2. Cost-Efficient TLC Flash Storage Module

Adopted mature 3D TLC flash particles with full capacity ranges from 8GB to 128GB. Optimized per-unit storage cost brings obvious advantages for bulk orders, perfectly matching mass production of mid-to-low-end consumer electronics while balancing performance and overall manufacturing expenditure.

3. Compact 153-Ball Slim FBGA Package

Standard 11.5×13mm thin BGA footprint with minimal space occupation and stable SMD soldering performance. It fits slim tablets and portable casting devices with limited PCB layout space, free of mechanical components to withstand minor daily vibration.

4. Intelligent Firmware for Complete Data Protection

Built-in algorithms including automatic wear leveling, real-time bad block detection and power-fail data retention. It lowers the risk of file corruption during system updates and video caching to extend the service life of embedded storage devices.

5. Broad Compatibility with Consumer Electronic Devices

Compatible with Android tablets, smart TVs, OTT set-top boxes, home projectors and indoor surveillance cameras. It supports mainstream main controller solutions and allows pre-flashing of system firmware before delivery for direct SMD mounting on production lines.

Our Advantages
30,000㎡ research and development base
Stable upstream and downstream supply chain
Leader in the storage field
High Grade service quality
Full Line automated testing
High Level technical R&D teams
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Prodotti raccomandati
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Persona di contatto : Ms. Sunny Wu
Telefono : +8615712055204
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