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eMMC5.1 Commercial Grade Flash Storage Chip with High Read Write Speed and Low Power Consumption

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eMMC5.1 Commercial Grade Flash Storage Chip with High Read Write Speed and Low Power Consumption
Características Galeria Descrição de produto Peça umas citações
Características
Especificações
personalizado: Apoiar
Tipo de pacote: BGA (matriz de grade de bolas)
particionamento: Suporta múltiplas partições, incluindo RPMB, partições GP
Compatibilidade: Smartphone
Largura do ônibus: 8 bits
Temperatura de trabalho: -25~85℃
Tipo de Nand Flash: NAND 3D
Principais recursos: Boa qualidade, alto desempenho
Função: Memória
Tensão: 1,8 V / 3,3 V
Destacar:

IOT device embedded eMMC flash

,

High reliability wide temp eMMC

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Embedded system original eMMC

Informação básica
Lugar de origem: Shenzhen, China
Marca: PG
Número do modelo: G28128TLCB/G28256TLCB/G2864GTLCB
Condições de Pagamento e Envio
Tempo de entrega: 10 a 15 dias
Termos de pagamento: L/C,T/T
Habilidade da fonte: 100k por mês
Descrição de produto
eMMC5.1 Commercial Grade EMMC Flash Storage Chip High Read Write Speed Embedded Memory Module
Product Overview

eMMC5.1 Mini Compact EMMC Flash IC Low Power Consumption For Mobile Portable Devices

Key Features
1. JEDEC Compliant eMMC 5.1 High-Speed Interface

Fully compliant with JEDEC industry standards and equipped with HS400 high-speed transmission mode, delivering a maximum sequential read speed of 230MB/s. It enables smooth system boot-up for smart TVs, tablets and OTT set-top boxes, and backward-compatible with legacy motherboards supporting eMMC 4.5 & 5.0 for direct hardware replacement without circuit modification.

2. Cost-Efficient TLC Flash Storage Module

Adopted mature 3D TLC flash particles with full capacity ranges from 8GB to 128GB. Optimized per-unit storage cost brings obvious advantages for bulk orders, perfectly matching mass production of mid-to-low-end consumer electronics while balancing performance and overall manufacturing expenditure.

3. Compact 153-Ball Slim FBGA Package

Standard 11.5×13mm thin BGA footprint with minimal space occupation and stable SMD soldering performance. It fits slim tablets and portable casting devices with limited PCB layout space, free of mechanical components to withstand minor daily vibration.

4. Intelligent Firmware for Complete Data Protection

Built-in algorithms including automatic wear leveling, real-time bad block detection and power-fail data retention. It lowers the risk of file corruption during system updates and video caching to extend the service life of embedded storage devices.

5. Broad Compatibility with Consumer Electronic Devices

Compatible with Android tablets, smart TVs, OTT set-top boxes, home projectors and indoor surveillance cameras. It supports mainstream main controller solutions and allows pre-flashing of system firmware before delivery for direct SMD mounting on production lines.

Our Advantages
30,000㎡ research and development base
Stable upstream and downstream supply chain
Leader in the storage field
High Grade service quality
Full Line automated testing
High Level technical R&D teams
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Pessoa de Contato : Ms. Sunny Wu
Telefone : +8615712055204
Caracteres restantes(20/3000)