Automotive Grade eMMC 5.1 BGA153 HS400 Embedded Flash Storage 64GB 128GB for ADAS IVI
Product Summary
Product Details
Automotive Grade eMMC 5.1
,HS400 High Speed Embedded Storage
,Wide Temperature BGA153 Flash Memory
Product Description
This automotive-grade eMMC 5.1 embedded flash storage is purpose-built for demanding onboard electronic systems. Compliant with the JEDEC eMMC 5.1 standard and qualified for automotive applications, it delivers consistent high-speed performance, long-term data integrity, and reliable operation across extreme temperature ranges. Its compact BGA153 package and scalable capacity options make it the ideal storage foundation for next-generation vehicle electronics.
- High-Speed HS400 Interface: Supports HS400 high-speed mode with transfer rates up to 400MB/s, accelerating system boot, map loading, and data logging for faster in-vehicle responsiveness.
- Flexible Capacity Options: Available in 64GB and 128GB densities to match diverse ADAS, IVI, and telematics storage requirements.
- Automotive-Grade Reliability: Built with advanced NAND flash management including wear leveling, bad block management, and ECC to preserve data integrity over the product lifetime.
- Wide Temperature Range: Stable operation from -40°C to 105°C, fully compliant with automotive temperature grade requirements.
- Secure Data Protection: Integrated RPMB, secure boot, and write protection safeguard critical vehicle data and prevent unauthorized access.
- Low Power Architecture: Optimized power management ensures energy-efficient operation compatible with vehicle power supply systems.
- Compact BGA153 Package: Controller and NAND flash integrated in a single 11.5 x 13 x 1 mm package, minimizing PCB footprint and simplifying hardware design.
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 64GB, 128GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Operating Temperature | -40°C to +105°C |
| NAND Flash | MLC / TLC / QLC |
| Security | RPMB, secure boot, write protection |
| Package | BGA 153 (Ball Grid Array) |
| Package Size | 11.5 x 13 x 1 mm |