| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 compliant, supports HS400 mode |
| Available Capacities | 32GB, 64GB |
| Data Transfer Speed | Up to 400MB/s under HS400 mode |
| Operating Voltage | 3.3V (VCC), 1.8V / 3.3V (VCCQ) |
| Endurance | Optimized endurance to support frequent read & write operations |
| Security Functions | RPMB partition, secure boot and hardware write protection |
| Operating Temperature | 0°C ~ 70°C |
| Package Dimension | 11.5 × 13 × 1 mm |
| Package Type | BGA153 (Ball Grid Array) |