| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 32GB, 64GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Operating Temperature | 0°C to 70°C |
| Package Size | 11.5 x 13 x 1 mm |
| Package | BGA 153 (Ball Grid Array) |