EMMC5.1 64GB 128GB 256GB Industrial Grade EMMC 5.1 Flash Memory Chip Wide Temp BGA Embedded Storage
Product Specification
Place of Origin:
Shenzhen, China
Brand Name:
PG
Model Number:
G28128TLIA/G28256TLIA/G2864GTLIA
Minimum Order Quantity:
50pcs
Price:
Negotiable
Delivery Time:
10 to 15 days
Payment Terms:
L/C,T/T
Supply Ability:
100K a month
Product Summary
EMMC5.1 64GB 128GB 256GB Industrial Grade EMMC 5.1 Flash Memory Chip Wide Temp BGA Embedded Storage Industrial-grade eMMC 5.1 flash memory chips available in 64GB, 128GB, and 256GB capacities, designed for wide temperature operation and embedded storage applications. Key Features High-Speed eMMC 5.1 ...
Product Details
Highlight:
eMMC chip
,embedded flash eMMC
,eMMC memory IC
Bus Width:
8-bit
Bus Speed:
HS400 Up To 400 MB/s
Appearance:
11.5mmx13mmx1.0mm
Storage Temperature:
-40-85℃
Compatible:
Learning Tablet
Logo:
Custom
Origin:
SZ
Oem:
Support
Color:
Black
Product Description
EMMC5.1 64GB 128GB 256GB Industrial Grade EMMC 5.1 Flash Memory Chip Wide Temp BGA Embedded Storage
Key Features
- High-Speed eMMC 5.1 Standard Protocol Fully compliant with official eMMC 5.1 industry standards, supports high-speed data transmission bus, significantly improves sequential read/write efficiency, and compatible with most mainstream embedded motherboard chipsets.
- Wide Temperature Industrial Grade Chip Industrial wide temperature design ensures stable operation in -40℃ to 85℃ environments, with no data loss or performance degradation under extreme cold and high temperature conditions.
- Stable TLC NAND Flash Memory Cell Utilizes high-quality TLC NAND flash particles for balanced storage performance and cost, uniform storage particle quality, and effectively reduces bad block generation rate during long-term operation.
- Built-in Hardware Wear Leveling Algorithm Hardware-level automatic wear leveling technology evenly distributes data writing cycles across all storage blocks, effectively extending the overall service life of the eMMC chip.
- Anti-Vibration Embedded Storage Module Compact BGA solid packaging structure provides strong shock and vibration resistance, making it suitable for mobile industrial equipment that frequently experiences vibration during operation.
Our Advantages
30,000㎡ research and development base
Stable upstream and downstream supply chain
Leader in the storage field
High Grade service quality
Full Line automated testing
High Level technical R&D teams
Patent Certificate
Product Images
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