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Wide Temperature Embedded Memory EMMC 5.1 64GB Flash Memory Chips For Automotive

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Wide Temperature Embedded Memory EMMC 5.1 64GB Flash Memory Chips For Automotive
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Produkt: Motoryzacyjny eMMC 5.1
Orzecznictwo: AEC-Q100
Temperatura pracy: -40°C~105°C
Przypadek użycia: inteligentne kokpity i systemy ADAS
fabryka: Tak
Prędkość zapisu: Do 240 MB/s
Typ pakietu: 153BGA
Czytaj prędkość: Do 330 MB/s
OEM: Powitanie
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Podstawowe informacje
Miejsce pochodzenia: Shenzhen, Chiny
Nazwa handlowa: PG
Zapłata
Szczegóły pakowania: Opakowanie domyślne lub opakowanie niestandardowe
Czas dostawy: 3 do 15 dni
Zasady płatności: L/C, T/T
Możliwość Supply: 100k miesięcznie
opis produktu
Wide Temperature Embedded Memory EMMC 5.1 64GB Flash Memory Chips For Automotive

Our 64GB 128GB automotive-grade eMMC 5.1 flash memory is designed for high-performance embedded storage in vehicles, delivering reliable and stable operation under extreme conditions. With support for wide temperature ranges from -40°C to 105°C, this eMMC is ideal for smart cockpits, ADAS systems, in-vehicle infotainment (IVI), and automotive radar applications.

Key Features of Automotive Grade eMMC 5.1
  • Wide Temperature Operation: Maintains stable performance across extreme automotive environments (-40°C to 105°C)
  • High-Speed eMMC 5.1 Interface: Ensures rapid boot times, fast data access, and smooth system performance
  • Durable Flash Memory: High endurance design suitable for continuous read/write cycles in ADAS, HUD, and IVI systems
  • Advanced Error Correction: LDPC/ECC technology protects against data corruption, increasing reliability for long-term automotive applications
  • OEM/Automotive-Grade Quality: Manufactured to meet stringent automotive standards for safety, reliability, and longevity
Technical Specifications of Automotive Grade eMMC 5.1
Parameter Details
Interface eMMC 5.1 with HS400 support
Capacities 32GB, 64GB, 128GB, 256GB
Data Transfer Speed Up to 400MB/s (HS400 mode)
Operating Voltage 3.3V (VCC), 1.8V/3.3V (VCCQ)
Temperature Range -40°C~105°C
Endurance High endurance for frequent read/write cycles
Security RPMB, secure boot, and write protection
Package BGA (Ball Grid Array)
Package Size 11.5 x 13 x 1 mm
Factory Images
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Skontaktuj się z nami
Osoba kontaktowa : Ms. Sunny Wu
Tel : +8615712055204
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