| Capacity | 8GB-256GB |
|---|---|
| Agreement | HS400 |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -40℃~+85℃/-45℃~+105℃ |
| Package Type | BGA153 |
|---|---|
| Bus Width | 1-bit, 4-bit, 8-bit |
| Productname | EMMC Memory Card |
| Typicalapplications | Smartphones, Tablets, IoT Devices |
| Power Consumption | Typical 50mA Active |
| Nand Flash | MLC/TLC/QLC |
|---|---|
| Voltage | 2.7V-3.6V |
| Manufacturer | PG |
| Color | Black |
| Capacity | 8GB, 16GB, 32GB, 64GB, 128GB, 256GB, 512GB |
| Name | PG Industrial Grade EMMC 5.1 |
|---|---|
| Capacity | 64GB / 128GB / 256GB / 512GB |
| Protocol | HS400 |
| Wafer | Industrial Grade KIOXIA Wafer |
| Read Speed | Up To 330MB/s |
| Name | PG Industrial Grade EMMC |
|---|---|
| Capacity | 64GB / 128GB / 256GB / 512GB |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -40℃~+85℃ / -45℃~+105℃ |
| Appearance | 11.5mmx13mmx1.0mm |
|---|---|
| Write Speed | 240MB/s |
| Capacity | 64GB / 128GB / 256GB / 512GB |
| Oem | OEM |
| Sequential Write Speed | Up To 240 MB/s |
| Capacity | 64GB |
|---|---|
| Agreement | HS400 |
| Read Speed | Up To 330MB/s |
| Write Speed | Up To 240MB/s |
| Operating Temperature | -40℃~+85℃/-45℃~+105℃ |
| Memory Interface | EMMC5.1 |
|---|---|
| Random Read Iops | Up To 3000 IOPS |
| Form Factor | BGA (Ball Grid Array) |
| Bus Width | 1-bit, 4-bit, 8-bit |
| Nand Type | MLC / TLC |
| Warranty Period | 1 Years |
|---|---|
| Memory Density | 64GB/128GB/256GB |
| Form Factor | 153 WFBGA |
| Nandtype | MLC/TLC |
| Voltage | Standard (not Specified) |
| Warranty | 1years |
|---|---|
| Product Completion | Standard |
| Mtbf (Mean Time Between Failures) | 1 Million Hours |
| Choice Of Flash | 3DTLC |
| Length | 13mm |