| Product Name | Automotive Grade EMMC5.1 |
|---|---|
| Use Case | Automotive Radar & ADAS |
| Error Correction | Built-in ECC (Error Correction Code) |
| Manufacturer | PG |
| Choice Of Flash | 3DTLC |
| Standard | EMMC 5.1 |
|---|---|
| Security Features | Secure Trim, Secure Erase, Replay Protected Memory Block (RPMB) |
| Packeage Type | 153 FBGA |
| Compliance | IATF 16949 |
| Package | BGA153 |
| Compatibility | Automotive Electronics Field |
|---|---|
| Oem Odm | Support |
| Durability | Shockproof |
| Mtbf | High MTBF Suitable For Automotive Use |
| Power Consumption | Low Power Consumption Mode Supported |
| Capacity Options | 64GB, 128GB, 256GB |
|---|---|
| Aplication | Vehicle Communication And Control |
| Package | BGA153 Package |
| Logo | Customized Logo |
| Material | Plastic |
| Product Name | Automotive EMMC Embedded MultiMediaCard |
|---|---|
| Mtbf | High MTBF Suitable For Automotive Use |
| Working Temperature | -45~105℃ |
| Protocol | HS400 |
| Memory | Flash |
| Product | EMMC Automotive Grade |
|---|---|
| Nand Flash Type | 3D NAND |
| Manufacturer | China Chips Star |
| Condition | New / Good Health |
| Products Status | New |
| Product Name | Automotive Grade EMMC5.1 |
|---|---|
| Flash | 3D TLC Nand Flash |
| Wafer | KIOXIA |
| Size | 11.5x13x1.0/11.5x13x1.2 |
| Material | Plastic |
| Use Case | T-Box Vehicle Telematics |
|---|---|
| Package Type | BGA (Ball Grid Array) |
| Form Factor | BGA (Ball Grid Array) |
| Wafer | KIOXIA |
| Capacity Options | 64GB, 128GB, 256GB |
| Product | Emmc Ic |
|---|---|
| Certification | AEC-Q100 |
| Working Temperature | -40°C~105°C |
| Use Case | Smart Cockpits And ADAS Systems |
| Factory | Yes |
| Product | Automotive EMMC 5.1 |
|---|---|
| Use Case | HUD And AR-HUD Platforms |
| Factory | Yes |
| Write Speed | Up To 240 MB/s |
| Packeage Type | 153BGA |