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HS400 Automotive Grade eMMC 5.1 64GB 128GB BGA153 In-Vehicle Infotainment Flash

Product Specification
Place of Origin: Shenzhen, China
Brand Name: PG
Certification: IATF 16949, CE, RoHS, AEC-Q100, ISO 9001
Model Number: G2864GTLCA
Minimum Order Quantity: 50 Pieces
Price: Negotiable
standard packaging: Anti-static tray + vacuum sealed bag, export-grade carton
Delivery Time: 10 to 15 days
Payment Terms: T/T,L/C
Supply Ability: 100K Pieces per Month

Product Summary

HS400 automotive eMMC 5.1, 64GB BGA153 embedded flash for In-Vehicle Infotainment (IVI), -40C to 105C.

Product Details

Highlight:

HS400 eMMC 5.1 Interface

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64GB IVI Embedded Storage

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Automotive BGA153 Flash Memory

Product Name: HS400 Automotive EMMC 5.1
Application: In-Vehicle Infotainment (IVI)
Capacity: 64GB
Interface: EMMC 5.1 HS400
Package: BGA153 (11.5 X 13 Mm)
NAND Flash: 3D TLC
Operating Temperature: -40C To 105C
Certification: IATF 16949, AEC-Q100, RoHS, CE

Product Description

HS400 Automotive Grade eMMC 5.1 64GB 128GB BGA153 In-Vehicle Infotainment Flash
Product Introduction

For In-Vehicle Infotainment (IVI), the G2864GTLCA supplies 64GB of automotive grade 3D TLC embedded flash in a compact BGA153 package.

A robust command queue and HS400 timing keep latency low during mixed read and write traffic. The HS400 high-speed interface delivers fast boot and responsive data access, cutting firmware load times in demanding in-vehicle systems.

At 64GB, capacity is matched to real automotive workloads, leaving margin for updates while the controller preserves data integrity from -40C to 105C.

Production follows a controlled semiconductor supply chain with lot-level traceability, and each unit is functionally tested across the full operating range. Qualification support includes datasheets, reliability reports, and application engineering so your integration proceeds with fewer surprises.

Quality and Reliability Assurance

Automotive grade process discipline is applied from wafer sort through packaging and final electrical test.

Model Range
Model Capacity Protocol NAND Package Dimensions Operating Temp. Storage Temp.
G2832TLCA 32GB eMMC 5.1 3D TLC FBGA153 11.5 x 13 mm -40C to 105C -50C to 125C
G2864GTLCA 64GB eMMC 5.1 3D TLC FBGA153 11.5 x 13 mm -40C to 105C -50C to 125C
G28128TLCA 128GB eMMC 5.1 3D TLC FBGA153 11.5 x 13 mm -40C to 105C -50C to 125C
Technical Specifications
Parameter Value
Brand PG
Model Number G2864GTLCA
Capacity 64GB
Interface eMMC 5.1 HS400
Package BGA153 (11.5 x 13 x 1.0 mm)
NAND Flash 3D TLC with LDPC ECC
Operating Temperature -40C to 105C
Storage Temperature -50C to 125C
Supply Voltage 3.3V VCC / 1.8V VCCQ
Sequential Read Up to 330 MB/s
Sequential Write Up to 240 MB/s
Certification IATF 16949, AEC-Q100
Primary Application In-Vehicle Infotainment (IVI)
Key Features and Advantages
  • eMMC 5.1 HS400 interface for fast boot and low-latency data access
  • Full lot-level traceability from wafer to finished device
  • 64GB 3D TLC embedded flash in a compact BGA153 package
  • Low power draw suitable for always-on vehicle electronics
  • Controlled supply chain with documented reliability reports
  • Wide operating temperature from -40C to 105C
  • Compact 11.5 x 13 mm footprint for dense module layouts
  • Command queue and cache support for mixed read and write traffic
Applications

Across these modules, the device keeps firmware, maps, and logs safe and quickly accessible.

  • In-Vehicle Infotainment (IVI)
  • In-vehicle infotainment (IVI) head units
  • Rear-seat entertainment systems
  • Digital cockpit platforms
  • Navigation and media modules
  • Over-the-air firmware storage
FAQ
Q: How fast is the HS400 interface on this automotive eMMC?
A: The device runs in eMMC 5.1 HS400 mode with sequential read up to 330 MB/s and sequential write up to 240 MB/s, accelerating firmware boot and data-heavy automotive workloads.
Q: Is the device suitable for continuous operation?
A: Yes. The automotive grade NAND and wear leveling are designed for continuous read and write activity in vehicles.
Q: Can I get a price quotation?
A: Share your target capacity and annual volume and we will provide a quotation promptly.
Q: Can the interface be integrated easily?
A: The eMMC 5.1 interface follows the standard JEDEC command set, simplifying integration with automotive SoCs.
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