Automotive Grsde eMMC 5.1 Origina IC Chip Automotive eMMC 5.1 128GB BGA153 Embedded Storage
Product Summary
Product Details
eMMC 5.1 128GB
,eMMC miniature package
,128GB BGA153 Embedded Storage
Product Description
Automotive Grsde eMMC 5.1 Origina IC Chip Automotive eMMC 5.1 128GB BGA153 Embedded Storage
The PG G28128TLCA is an original good die IC chip based automotive eMMC 5.1 embedded storage device providing 128GB of capacity in a BGA153 package. Sourced from traceable, known-good wafers, it is engineered for digital instrument clusters, advanced driver assistance systems (ADAS), and in-vehicle infotainment platforms that cannot tolerate the risk of remark or refurbished components.
Original good die means the integrated circuit is built from first-quality, fully tested wafer material with documented provenance rather than reclaimed or downgraded silicon. This sourcing discipline is critical in automotive electronics, where a substandard chip can compromise safety and long-term reliability. Every G28128TLCA carries traceability from wafer lot to finished unit, supported by our PG brand manufacturing and testing processes.
With the eMMC 5.1 HS400 interface, this embedded storage delivers sequential read speeds up to 400 MB/s and robust write performance, while 3D TLC NAND flash with LDPC ECC and power-loss protection preserve data integrity. The 128GB capacity offers ample room for rich cluster graphics, navigation data, and over-the-air updates across a -40C to 105C operating range.
Product Model
| Model | Capacity | Protocol Standards | NAND | Package | Dimensions | Operating Temperature | Storage Temperature |
| G2864GTLCA | 64GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G28128TLCA | 128GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G28256TLCA | 256GB | eMMC 5.1 | 3D TLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
| G2819GPLCA | 19GB | eMMC 5.1 | pSLC | FBGA153 | 11.5*13mm | -40℃~105℃ | -50℃~125℃ |
Technical Specifications
| Parameter | Value |
|---|---|
| Brand | PG |
| Model Number | G28128TLCA |
| Capacity | 128GB |
| Interface | eMMC 5.1 HS400 |
| Package | BGA153 (11.5 x 13 x 1.0 mm) |
| IC Grade | Original |
| Operating Temperature | -40C to 105C |
| Supply Voltage | 3.3V VCC / 1.8V VCCQ |
| Sequential Read | Up to 400 MB/s |
| NAND Flash | 3D TLC with LDPC ECC |
| Qualification | AEC-Q100 Grade 2 |
Key Features and Advantages
- Original good die IC chip with traceable wafer provenance
- 128GB capacity for graphics, navigation, and OTA data
- eMMC 5.1 HS400 interface with read speed up to 400 MB/s
- BGA153 package for compact in-vehicle board designs
- 3D TLC NAND flash with LDPC ECC for data integrity
- Power-loss protection for reliable automotive operation
- Automotive grade temperature range from -40C to 105C
Typical Applications
- Digital instrument clusters
- Advanced driver assistance systems (ADAS)
- In-vehicle infotainment (IVI) systems
- Head-up display (HUD) controllers
- Domain controllers
Quality and Reliability Assurance
PG sources original good die IC chip material from known-good wafers with complete lot-level traceability, then applies in-house testing to every automotive eMMC 5.1 embedded storage device. Each 128GB unit undergoes temperature cycling, burn-in, and functional verification before shipment, and ships with full datasheets and reliability reports. Our engineering team supports qualification and integration for digital instrument clusters and ADAS platforms, ensuring the integrated circuit you receive is genuine, reliable, and fully documented for your automotive supply chain.
Frequently Asked Questions
Q: What does original good die mean for this automotive IC chip?
A: It means the eMMC is manufactured from first-quality, fully tested wafer material with documented provenance, not reclaimed or downgraded silicon. This sourcing discipline protects the safety and long-term reliability of automotive applications.
Q: Can you provide traceability documentation for the IC chip?
A: Yes. We provide lot-level traceability from wafer to finished device and can supply supporting documentation to help you meet your supply chain qualification requirements.
Q: Is this 128GB embedded storage suitable for instrument clusters?
A: Yes. The capacity comfortably supports rich cluster graphics and navigation data, while the BGA153 package and AEC-Q100 Grade 2 qualification match the demands of digital instrument cluster designs.
