Product Summary
Product Details
Cost Effective TLC Storage
,Reliable eMMC 5.1 Performance
,Compact BGA153 Package
Product Description
Our eMMC 5.1 embedded memory chips offer 32GB and 64GB TLC capacity options designed for high-performance laptop applications. These premium chips integrate 3D NAND flash and a high-performance onboard controller within a compact 153-ball FBGA package.
They simplify peripheral circuit design and support efficient mass production mounting, featuring large capacity advantages with balanced performance and competitive cost. These chips serve as ideal embedded storage solutions for Android smart devices, smart displays, IoT terminals, and consumer electronics.
Equipped with optimized firmware algorithms and sophisticated hardware error correction mechanisms, these eMMC chips maintain steady read and write speeds, outstanding anti-interference performance, and long-term reliability. Supporting mainstream high-speed transmission modes and adaptive power management, they are well-suited for smart terminals requiring continuous operation and frequent data access.
- High Speed Performance: Supports eMMC 5.1 HS400 interface with transfer speed up to 400MB per second to shorten boot time and improve device performance
- Multiple Capacities: Available in 32GB and 64GB to meet standard storage demands of consumer devices
- Data Reliability: Built-in wear leveling, bad block management, and error correction functions to guarantee data integrity
- Energy Efficient: Low power design extends continuous working time of portable equipment
- Space Saving Design: Integrated BGA153 package effectively reduces PCB layout space
- Operating Temperature: Stable operation at 0°C to 70°C for consumer electronic applications
- Security Features: Embedded RPMB for secure data storage and information protection
Ideal for smart devices, household electronics, portable gadgets, and commercial terminals.
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 32GB, 64GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Operating Temperature | 0°C to 70°C |
| Package Size | 11.5 x 13 x 1 mm |
| Package | BGA 153 (Ball Grid Array) |
- Cost Effective Solution: Integrated TLC NAND flash and built-in controller lower overall BOM cost, well-suited for mass production consumer electronic devices
- Reliable Daily Performance: Supports stable operation within 0°C to 70°C, delivering consistent performance for regular indoor consumer electronics scenarios
- Easy Integration: Fully compliant with eMMC 5.1 standard interface, simplifying design and shortening time to market for consumer embedded systems
- Practical Storage Options: Offered in 32GB and 64GB capacities to precisely meet mainstream storage requirements of lightweight smart devices
- Optimized for Consumer Electronics: Combining low power consumption and compact BGA153 package, it is an excellent choice for space-limited, battery-powered consumer terminals
- Datasheets: Full technical specifications covering electrical characteristics and performance parameters under 0°C to 70°C operating temperature
- Design Guides: Complete integration guidelines and best practices for consumer embedded storage projects
- Technical Support: Professional technical support for product design and performance verification
Planning to deploy our Consumer Grade eMMC 5.1 NUW0 32GB and 64GB 0°C to 70°C in your project? Contact our sales team for quotations, sample evaluation, and customized solutions.
