Product Summary
Product Details
Automotive Grade eMMC 5.1
,eMMC 5.1
,eMMC
Product Description
PG Automotive-Grade eMMC 5.1 is a high-performance embedded storage solution specifically designed for automotive applications. Engineered to meet stringent operating standards for onboard electronics, it delivers exceptional reliability and consistent performance in demanding environments. With compact packaging and excellent scalability, it serves as the ideal storage solution for a wide range of automotive electronic systems.
- High-Speed Transmission: Compliant with eMMC 5.1 standard, supports HS400 high-speed mode with maximum transfer speeds up to 400MB/s, enhancing system responsiveness and reducing startup times.
- Diversified Capacity Selection: Available in 64GB and 128GB options to meet varied storage requirements of automotive electronic equipment.
- Long-Term Operational Stability: Utilizes advanced NAND Flash technology with built-in wear leveling, bad block management, and error correction mechanisms to ensure complete data integrity throughout product lifespan.
- Low Power Design: Features optimized power management architecture, compatible with vehicle power supply systems for stable and energy-efficient operation.
- Compact Highly Integrated Structure: Flash memory and dedicated controller integrated in a single BGA package, minimizing PCB space requirements and simplifying end-product development.
- Wide Temperature Adaptability: Maintains stable performance across -40°C to 105°C range, fully meeting automotive-grade temperature requirements.
- Secure Data Protection: Equipped with integrated RPMB, supporting secure data storage and device authentication to protect critical automotive data.
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 64GB, 128GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Operating Temperature | -40°C to 105°C |
| Package Size | 11.5 x 13 x 1 mm |
| Package | BGA 153 (Ball Grid Array) |