| Protocol | HS400 |
|---|---|
| Application | Smartphone |
| Package | BGA153 Package |
| Reliability | Enhanced ECC And Wear Leveling |
| Capacity | 64GB-256GB |
| Condition | Good |
|---|---|
| Agreement | HS400 |
| Interface | MMC (MultiMediaCard) Interface |
| Sequential Write Speed | Up To 240 MB/s |
| Orign | China |
| Product Name | Automotive EMMC 64GB |
|---|---|
| Related Certifications | Related Certifications |
| Package Type | BGA153 |
| Size | 11.5x13x1.0/11.5x13x1.2 |
| Flash Grade | Grade A |
| Product | EMMC |
|---|---|
| Sequential Write Speed | Up To 240 MB/s |
| Package Type | BGA 153 |
| Products Status | New |
| Controller | SMI |
| Product | EMMC |
|---|---|
| Power Management | Advanced Power Management Features |
| Agreement | HS400 |
| Aplication | Tablet Computer |
| Logo Customized Service | Available |
| Memory Interface | EMMC5.1 |
|---|---|
| Random Read Iops | Up To 3000 IOPS |
| Form Factor | BGA (Ball Grid Array) |
| Bus Width | 1-bit, 4-bit, 8-bit |
| Nand Type | MLC / TLC |
| Name | Industrial EMMC For IoT Edge Computing |
|---|---|
| Wafer | KIOXIA |
| Controller | SMI |
| Warranty | 3 Years |
| Write Speed | 240MB/s |
| Name | Industrial Memory Flash IC EMMC |
|---|---|
| OEM | Welcomed |
| Wafer | KIOXIA |
| Controller | SMI |
| Write Speed | 240MB/s |
| Product Name | Automotive Grade Embedded EMMC |
|---|---|
| Capacity | 64G 128G 256G |
| Write Speed | Up To 240MB/S |
| Function | Memory |
| Package Type | BGA153 |
| Product Name | PG Brand 256GB EMMC |
|---|---|
| Package | BGA Package |
| Key Features | Good Quality, High Performance |
| Nand Flash | MLC/TLC/QLC |
| Origin | China |