Our high-endurance pSLC eMMC 5.1 embedded memory chips are available in 4GB, 8GB, and 16GB capacities. Adopting a standard 153-ball FBGA package, the product fully complies with JEDEC eMMC 5.1 specifications.
Built on pSLC technology, the chip configures NAND flash cells for single-bit data storage and achieves up to 30,000 P/E cycles, significantly outperforming conventional TLC eMMC (around 3,000 P/E cycles). This pSLC eMMC 5.1 is engineered for embedded scenarios demanding frequent write operations and outstanding operational stability.
pSLC architecture delivers exceptional write endurance, perfect for 24/7 continuous video storage applications.
The compact BGA153 package supports miniaturized monitoring hardware design and space-constrained applications.
Stores HD video streams and supports loop recording, guaranteeing reliable data preservation during critical events.
Supports simultaneous multi-channel video writing, stable 7*24-hour surveillance data storage, as well as rapid data search and playback.
Stores access logs and facial recognition data. Low power consumption makes it ideal for battery-operated access control equipment.
eMMC 5.1 with HS400 high-speed mode, maximum transfer speed up to 400MB/s
4GB, 8GB, 16GB
BGA153 (11.5*13.0mm), compatible with most mainstream embedded mainboards
pSLC technology supports 30,000 P/E cycles to greatly prolong device service life
Integrated ECC error correction, bad block management, and wear leveling algorithms to protect data integrity
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1 with HS400 support |
| Available Capacities | 32GB, 64GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Operating Temperature | 0°C to 70°C |
| Package Size | 11.5 x 13 x 1 mm |
| Package | BGA 153 (Ball Grid Array) |
Integrated PSLC NAND flash and onboard controller streamline circuit design and lower overall BOM cost, perfectly suited for mass-production consumer electronic devices.
Rated for a standard consumer temperature range of 0°C to 70°C, this eMMC chip delivers consistent and reliable operation in daily indoor and regular consumer scenarios.
Fully compliant with universal eMMC 5.1 interface standards, enabling simple design adoption and faster time-to-market for embedded consumer products.
Available in 4GB, 8GB and 16GB capacities to precisely match the basic storage requirements of mainstream lightweight smart devices.
Featuring optimized power consumption and a compact BGA153 package, it fits perfectly for space-limited, battery-powered consumer electronics with high energy efficiency demands.