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China Chips Star Semiconductor Concludes Successful Exhibition at Embedded World 2026

March 13, 2026

Neueste Unternehmensnachrichten über China Chips Star Semiconductor Concludes Successful Exhibition at Embedded World 2026

March 12, 2026, the Embedded World 2026, a premier global event for the embedded systems industry, successfully concluded today. During the exhibition, the booth of China Chips Star Semiconductor Co., Ltd attracted significant attention from global professionals in the fields of industrial automation, automotive electronics, and edge computing. At this event, China Chips Star Semiconductor Co., Ltd highlighted its key products: automotive/industrial-grade eMMC and industrial-grade memory cards.

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China Chips Star Semiconductor's PG brand industrial-grade eMMC 5.1 is specifically engineered for industrial applications. It supports stable operation across a wide temperature range from -40°C to 85°C and offers high resistance to vibration and shock, effectively handling complex conditions such as extreme temperatures and strong vibrations. It is widely compatible with industrial gateways, industrial PCs, intelligent terminals, and in-vehicle devices, providing reliable and stable storage support for industrial intelligence.

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China Chips Star Semiconductor's PG brand industrial-grade TF card is also designed for industrial environments. It withstands high and low temperatures, is resistant to drive drop-off, and offers an extended lifespan. Operating stably from -40°C to 85°C, it is shockproof, dustproof, and endures repeated erasing and writing. Equipped with ECC error correction and wear leveling technology, it supports 24/7 continuous read/write operations and ensures data integrity during power failures, guaranteeing long-term reliability. It is ideally suited for demanding applications such as vehicle-mounted surveillance, industrial tablets, intelligent terminals, and IoT devices. With its compact size and exceptional stability, it serves as a reliable storage core for industrial equipment.

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