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Quality NUW eMMC 5.1 PSLC 8Gb 16Gb Embedded Flash Memory IC BGA153 HS400 High Endurance Boot Storage factory
Quality NUW eMMC 5.1 PSLC 8Gb 16Gb Embedded Flash Memory IC BGA153 HS400 High Endurance Boot Storage factory
Quality NUW eMMC 5.1 PSLC 8Gb 16Gb Embedded Flash Memory IC BGA153 HS400 High Endurance Boot Storage factory
Quality NUW eMMC 5.1 PSLC 8Gb 16Gb Embedded Flash Memory IC BGA153 HS400 High Endurance Boot Storage factory

NUW eMMC 5.1 PSLC 8Gb 16Gb Embedded Flash Memory IC BGA153 HS400 High Endurance Boot Storage

Product Specification
Place of Origin: China
Brand Name: PG / NUW
Certification: RoHS Compliant
Model Number: NUW PSLC eMMC 5.1 8Gb/16Gb
Minimum Order Quantity: 50 Pieces
standard packaging: Anti-static tray or tape and reel, desiccant sealed, export-grade carton
Delivery Time: 3-5 working days
Payment Terms: L/C,T/T
Supply Ability: 100000 Pieces per Month

Product Summary

NUW PSLC eMMC 5.1 in 8Gb and 16Gb densities, BGA153 package, HS400 up to 400MB/s with high P/E endurance for boot code, firmware and small-density embedded storage.

Product Details

Highlight:

PSLC High Endurance eMMC

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8Gb 16Gb Boot Code Storage

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eMMC 5.1 HS400 BGA153

Interface: EMMC 5.1 HS400 / HS200 / HS / DDR
Capacity: 8Gb (1GB), 16Gb (2GB), 4Gb On Request
NAND Flash: PSLC (pseudo-SLC) High Endurance Mode
Package: BGA153, 11.5 X 13 X 1 Mm
Data Transfer Speed: Up To 400MB/s In HS400 Mode
Operating Voltage: 3.3V VCC, 1.8V / 3.3V VCCQ
Operating Temperature: 0°C To 70°C
Endurance: PSLC Mode For Higher P/E Cycles Than TLC
Security: RPMB, Secure Boot, Write Protection
Application: Smart Home, Wearable, POS Terminal, Set-Top Box, IoT Module
Brand: NUW / PG

Product Description

NUW eMMC 5.1 PSLC 8Gb 16Gb Embedded Flash Memory IC BGA153
Small Density, High Endurance Storage for Boot Code and Firmware

Not every design needs 64GB. This NUW eMMC 5.1 part is offered in 8Gb and 16Gb densities with a PSLC (pseudo-SLC) configuration, which delivers noticeably higher program and erase endurance than standard TLC in the same footprint. It is the practical choice for systems that write small amounts of data constantly: boot images, configuration files, counters, logs and firmware updates on smart home appliances, wearables, POS terminals, set-top boxes and IoT modules.

Because the interface and BGA153 package follow the eMMC 5.1 standard, this part drops into existing layouts. Products can start with a small density and move to a larger TLC part later without changing the PCB.
At a Glance
Densities8Gb (1GB) / 16Gb (2GB), 4Gb on request
NAND TypePSLC pseudo-SLC high endurance
InterfaceeMMC 5.1 with HS400 support
Transfer SpeedUp to 400MB/s in HS400 mode
PackageBGA153, 11.5 x 13 x 1 mm
Temperature0°C to 70°C
Why PSLC for Small-Density Designs
  • Higher Endurance: pseudo-SLC mode trades density for program and erase cycles, which suits constant logging and counter writes
  • Predictable Latency: SLC-like write behavior keeps response time stable for real-time control firmware
  • Small Density, Real Cost Saving: 8Gb and 16Gb options avoid paying for capacity the product never uses
  • HS400 Speed: up to 400MB/s shortens boot time even on entry-level platforms
  • Compact BGA153: 11.5 x 13 x 1 mm saves board space in handheld and wearable devices
  • Built-in Security: RPMB, secure boot and write protection guard credentials and firmware
  • Integrated Controller: wear leveling, bad block management and ECC handled inside the package, no host-side tuning needed
Technical Specifications
ParameterDetails
InterfaceeMMC 5.1, HS400 support, backward compatible with HS200, HS and DDR
Available Densities8Gb (1GB), 16Gb (2GB); 4Gb available on request
NAND ConfigurationPSLC (pseudo-SLC) mode
Data Transfer SpeedUp to 400MB/s in HS400 mode
Operating Voltage3.3V (VCC), 1.8V / 3.3V (VCCQ)
Operating Temperature0°C to +70°C
PackageBGA153 (Ball Grid Array), 11.5 x 13 x 1 mm
Security FeaturesRPMB, secure boot, write protection
ReliabilityWear leveling, bad block management, hardware ECC
ConditionNew, original factory parts
Typical Applications
  • Smart Home Appliances: washing machine, air conditioner and refrigerator control boards with firmware and log storage
  • Wearables and Handhelds: smart watch, tracker and portable medical devices with tight space and power budgets
  • POS and Payment Terminals: secure boot image and transaction log storage with RPMB protection
  • Set-Top Boxes and Smart TV Modules: fast boot code storage that shortens start-up time
  • IoT Modules and Gateways: configuration, certificate and counter storage under continuous write load
Supply and Ordering

Minimum order quantity is 50 pieces, delivery in 3-5 working days for stock, supply capacity of 100K per month, and payment by L/C or T/T. Parts ship in anti-static trays or tape and reel with desiccant and humidity indicator. Share your density, annual volume and platform details and we will confirm pricing and samples.

Frequently Asked Questions
Q1: What does PSLC mean and when should I use it?
PSLC is pseudo-SLC: MLC or TLC cells are programmed in SLC mode, giving higher endurance and more stable write latency at the cost of density. It fits small-density designs that write frequently, such as logs, counters and configuration data.
Q2: Which densities can I order?
8Gb (1GB) and 16Gb (2GB) are standard, and 4Gb can be quoted on request. Larger consumer densities in TLC are available in the same BGA153 family if your product grows.
Q3: Can I keep the same PCB when moving to a bigger density?
Yes. All parts in this family follow the eMMC 5.1 interface and BGA153 11.5 x 13 x 1 mm footprint, so a density upgrade usually requires no layout change beyond firmware configuration.
Q4: Do you provide samples and technical support?
Yes. Samples, datasheets and HS400 timing information are available for design validation, and our team supports compatibility review for your platform before mass production.
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