eMMC 5.1 HS400 Embedded Memory IC 32GB 64GB TLC BGA153 400MB/s 3D NAND Smart Display Storage
Product Specification
Place of Origin:
China
Brand Name:
PG
Certification:
RoHS Compliant
Model Number:
NUW0 eMMC 5.1 HS400
Minimum Order Quantity:
50 Pieces
standard packaging:
Anti-static tray or tape and reel, desiccant sealed, export-grade carton
Delivery Time:
3-5 working days
Payment Terms:
L/C,T/T
Supply Ability:
100000 Pieces per Month
Product Summary
eMMC 5.1 embedded memory IC with HS400 400MB/s interface, 32GB and 64GB 3D TLC NAND in BGA153 package, 0C to 70C, for smart displays, Android tablets and IoT terminals.
Product Details
Highlight:
HS400 400MB/s eMMC 5.1
,32GB 64GB TLC 3D NAND
,Smart Display Android Embedded Storage
Interface:
EMMC 5.1 HS400 / HS200 / DDR
Capacity:
32GB, 64GB
NAND Flash:
3D TLC (MLC / QLC On Request)
Package:
BGA153, 11.5 X 13 X 1 Mm
Data Transfer Speed:
Up To 400MB/s In HS400 Mode
Operating Voltage:
3.3V VCC, 1.8V / 3.3V VCCQ
Operating Temperature:
0°C To 70°C
Security:
RPMB, Secure Boot, Write Protection
Application:
Smart Display, Android Tablet, IoT Terminal, Portable Device, Commercial Terminal
Brand:
PG
Product Description
eMMC 5.1 HS400 Embedded Memory IC 32GB 64GB TLC BGA153
Built for Smart Displays, Android Devices and IoT Terminals
This eMMC 5.1 embedded memory integrates 3D TLC NAND flash with an onboard controller in a single BGA153 package. With HS400 mode supporting up to 400MB/s, it shortens boot time and speeds up application loading on smart displays, Android tablets, portable devices and commercial terminals. The integrated design removes the need for a separate controller and peripheral circuit, which simplifies PCB layout and lowers total BOM cost for volume production.
Beyond raw speed, the firmware handles wear leveling, bad block management and error correction in the background, so read and write performance stays steady even under continuous operation and frequent data access.
At a Glance
InterfaceeMMC 5.1 with HS400 support
Capacities32GB / 64GB (3D TLC)
Transfer SpeedUp to 400MB/s (HS400)
PackageBGA153, 11.5 x 13 x 1 mm
Voltage3.3V VCC / 1.8V, 3.3V VCCQ
Temperature0°C to 70°C
Key Benefits for Device Designers
- Faster Boot and UI Response: HS400 high-speed mode reduces start-up time and app launch delay
- Lower BOM and Fewer Components: flash and controller in one package simplify circuit design and assembly
- Stable Long-Term Performance: wear leveling, bad block management and ECC work automatically in firmware
- Low Power for Portable Products: adaptive power management extends battery runtime of handheld terminals
- Compact Footprint: 11.5 x 13 x 1 mm BGA153 fits space-limited boards and high-density layouts
- Data Security: RPMB, secure boot and write protection protect credentials and firmware
- Mass Production Ready: standardized interface and packaging support fast ramp-up and multi-source supply
Technical Specifications
| Parameter | Details |
|---|---|
| Interface | eMMC 5.1, backward compatible with HS200, HS and DDR modes |
| Available Capacities | 32GB, 64GB |
| NAND Flash | 3D TLC (MLC and QLC options available on request) |
| Data Transfer Speed | Up to 400MB/s in HS400 mode |
| Operating Voltage | 3.3V (VCC), 1.8V / 3.3V (VCCQ) |
| Operating Temperature | 0°C to +70°C |
| Package | BGA153 (Ball Grid Array), 11.5 x 13 x 1 mm |
| Security Features | RPMB, secure boot, write protection |
| Reliability | Wear leveling, bad block management, hardware ECC |
| Condition | New, original factory parts |
Typical Applications
- Smart Displays and Digital Signage: system firmware boot partition plus media and app storage
- Android Tablets and E-Readers: fast boot and stable app performance at low power
- IoT Terminals and Gateways: reliable logging storage for always-on edge devices
- Smart Home and Household Electronics: voice assistant, router and appliance control boards
- Commercial Terminals: POS, kiosk and handheld terminals requiring frequent read and write access
Supply and Ordering
Minimum order quantity starts at 50 pieces with 3-5 working days delivery and 100K per month supply capacity, shipped against L/C or T/T terms in anti-static trays or tape and reel. Tell us your capacity mix and annual forecast and we will confirm price, samples and production schedule.
Frequently Asked Questions
Q1: Why choose eMMC 5.1 with HS400 instead of an earlier interface?
HS400 doubles the interface speed compared with HS200, reaching up to 400MB/s. That translates into faster boot, quicker app loading and smoother UI on smart displays and Android devices, while the BGA153 footprint stays compatible with existing designs.
Q2: Which capacities are available and can I mix them in one order?
32GB and 64GB are standard, both using 3D TLC NAND. Mixed capacity orders are accepted; MLC and QLC configurations can be quoted for specific projects.
Q3: Is this part suitable for outdoor or industrial use?
This is a consumer grade part rated 0°C to 70°C, ideal for indoor devices. For wider temperature requirements, industrial and automotive grade eMMC with the same BGA153 footprint can be quoted separately.
Q4: Can you provide samples and technical documents?
Yes. Samples, datasheets and integration guidance covering electrical characteristics and HS400 timing are available for design validation before mass production.
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