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EMMC 5.1 Ultra-Thin Thickness eMMC 5.1 Chip For Portable E-Book Reader

50pcs
MOQ
Negotiable
Price
EMMC 5.1 Ultra-Thin Thickness eMMC 5.1 Chip For Portable E-Book Reader
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Features
Specifications
Oem: Support
Operating Temperature: -25°C To 85°C
Factory: Yes
Condition: New
Nand Flash: TLC
Origin: Shenzhen
Bus Speed: HS400 (up To 400 MB/s)
Storage Capacity: 64GB/128GB/256GB
Data Bus Width: 8-bit
Commandset: MMC System Specification Version 5.1
Key Features: Embedded EMMC
Write Protection: Hardware And Software Write Protection
Use For: AI-Powered Smart Speaker
Security: Replay Protected Memory Block (RPMB) Support
Product Status: New
Appearance: 11.5mmx13mmx1.0mm
Highlight:

Ultra thin eMMC

,

E-reader storage

,

Low power flash

Basic Infomation
Place of Origin: Shenzhen, China
Brand Name: PG
Model Number: G2832GTLCB/ G2864GTLCB / G28128TLCB / G28256TLCB
Payment & Shipping Terms
Delivery Time: 10 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month
Product Description
EMMC 5.1 Ultra-Thin Thickness eMMC 5.1 Chip For Portable E-Book Reader
Product Overview

EMMC 5.1 Ultra-Thin Thickness eMMC 5.1 Chip specifically designed for portable e-book readers, offering optimized performance and space-saving design.

  • Ultra-Thin Wafer & Packaging Thickness Control Ultra-thinned packaging body greatly saves the internal stacking space of e-book readers, helping manufacturers design lighter and thinner ink screen reading devices.
  • Mass E-Book Resource Compatibility Storage Large-capacity versions store tens of thousands of e-books, comics and audio files, compatible with mainstream e-book formats, fast file browsing and page turning response speed.
  • E-Ink Screen Low Power Matching Optimization Deep sleep power mode matched with ink screen low refresh characteristics, extremely low power consumption during page static display, greatly prolong single charge reading duration.
  • Fast Page-Turn Random Access Performance Optimized small file random read speed, realize instant page jump and directory retrieval without loading delay, improve user reading experience.
  • Shock Resistance For Pocket Carrying Scenarios Reinforced internal bonding structure, withstand repeated extrusion and slight impact in backpacks and pockets, prevent solder joint detachment failure.
Product Images
EMMC 5.1 Chip front view showing BGA153 package EMMC 5.1 Chip side view demonstrating ultra-thin profile
Technical Specifications
Model G2832GTLCB / G2864GTLCB / G28128TLCB / G28256TLCB
Capacity 64GB / 128GB / 256GB
Brand PG
Package Type BGA153
Read Speed 330 MB/s
Write Speed 240 MB/s
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Contact Person : Ms. Sunny Wu
Tel : +8615712055204
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