logo

EMMC 5.1 Original Brand New EMMC 5.1 Flash IC Replacement For Mobile Phone Repair

50pcs
MOQ
Negotiable
Price
EMMC 5.1 Original Brand New EMMC 5.1 Flash IC Replacement For Mobile Phone Repair
Features Gallery Product Description Request A Quote
Features
Specifications
Factory: Yes
Aplication: Tablet Computer
Standard: EMMC 5.1
Logo: Custom
Command Queueing: Supported
Reliable Write: Supported
Boot Operation: Supported
Feature: Low
Color: Black
Working Temperature: -25~85℃
Highlight:

Camera eMMC

,

POS eMMC

,

Original eMMC

Basic Infomation
Place of Origin: Shenzhen, China
Brand Name: NUW
Model Number: G2504GPLCB / G2508GPLCB / G2516GPLCB
Payment & Shipping Terms
Delivery Time: 10 to 15 days
Payment Terms: L/C,T/T
Supply Ability: 100K a month
Product Description
EMMC 5.1 Original Brand New EMMC 5.1 Flash IC Replacement For Mobile Phone Repair
Product Overview

Original brand new EMMC 5.1 flash IC replacement designed specifically for mobile phone repair applications, featuring high reliability and direct compatibility.

Key Features
  • 1:1 Pin Compatible With Original Mobile eMMC Chip Fully consistent pin definition with mainstream smartphone built-in storage, enabling direct replacement during mobile phone motherboard repair without PCB modification.
  • Pre-Installed Clean Blank Storage Firmware Factory pre-burned standard blank firmware allows mobile phone maintenance technicians to directly flash official systems without secondary firmware writing operations.
  • Full Capacity Model Matching Old & New Smartphones Comprehensive coverage of 32GB/64GB/128GB/256GB mainstream mobile storage specifications, compatible with mid-range and legacy brand smartphone maintenance replacement requirements.
  • Low Bit Error Rate Brand New Original NAND Wafer Zero recycled refurbished particles with original first-cut NAND wafer production, preventing frequent flash memory failures in repaired mobile phones and reducing secondary after-sales return rates.
  • Standard Rework High Temperature Resistant Packaging Withstands hot air gun rework welding temperatures up to 260℃, ensuring no internal chip damage during mobile motherboard disassembly and replacement operations.
Technical Specifications
Model G2504GPLCB / G2508GPLCB / G2516GPLCB
Capacity 4GB / 8GB / 16GB
Brand PG
Wafer KIOXIA
Package Type BGA153
Read Speed 330 MB/s
Write Speed 240 MB/s
Recommended Products
Get in touch with us
Contact Person : Ms. Sunny Wu
Tel : +8615712055204
Characters Remaining(20/3000)