As the global automotive industry transitions toward electrification and intelligence (SDV - Software-Defined Vehicles), the demands placed on memory storage solutions have become unprecedentedly stringent. Critical applications such as Smart Cockpits (In-Vehicle Infotainment/IVI systems), Advanced Driver Assistance Systems (ADAS), and high-performance Dashcams/Black Boxes require storage chips with exceptional reliability, speed, and longevity.
In response to these market demands, China Chips Star, a premier provider of high-reliability storage solutions, officially announces that its highly mature automotive-grade eMMC 5.1 memory chips—G2864GTLCA (64GB) and G28128TLCA (128GB)—have achieved stable, large-scale mass production and are now shipping globally. Boasting superior extreme-environment tolerance and an exceptionally low DPPM (Defective Parts Per Million), this series is rapidly penetrating the Tier 1 front-mount (OEM) and high-end aftermarket supply chains of major automotive manufacturing nations.
1. Overcoming Automotive Storage Pain Points: Conquering Extreme Environments & High-Frequency Writing
Unlike consumer electronics, automotive-grade storage chips must maintain 24/7 error-free operations under harsh conditions, including extreme temperatures, violent vibrations, sudden power failures, and continuous high-frequency data writing.
The China Chips Star automotive eMMC 5.1 series features specialized firmware and hardware optimization designed to comply with global OEM technical specifications and real-world driving scenarios:
- Automotive-Grade Temperature Tolerance: Standard configurations comply with Automotive Grade 2 (-40°C to +105°C)
- Robust Power Loss Protection (PLP): Utilizing a proprietary dual hardware-charge monitoring and firmware-level anti-corruption algorithm, the chips ensure that critical driving data and system firmware remain completely secure and uncorrupted during sudden power drops or collision events.
- Endurance Algorithms Optimized for High-Frequency Writing: Tailored for the continuous small-file writing behavior of multi-channel HD dashcams (Black Boxes), the firmware features enhanced Garbage Collection (GC) and advanced Wear Leveling mechanisms to maximize flash memory lifespan.
2. Technical Specifications & Ecosystem Compatibility
Both core models, G2864GTLCA and G28128TLCA, are housed in the industry-standard FBGA 153 package. To guarantee seamless integration, these chips have undergone comprehensive joint validation with leading global and regional automotive SoC platforms (including Telechips, Samsung Exynos Auto, Qualcomm Snapdragon, NXP, and Renesas), supporting effortless drop-in replacement and agile system deployment.
Product Core Technical Specifications
| Feature / Parameter |
G2864GTLCA |
G28128TLCA |
| Capacity |
64GB |
128GB |
| Interface / Protocol |
eMMC 5.1 (Supports HS400 mode) |
eMMC 5.1 (Supports HS400 mode) |
| Package Type |
Standard FBGA 153 (11.5mm x 13mm) |
Standard FBGA 153 (11.5mm x 13mm) |
| Operating Temperature |
-40°C ~ +105℃ |
-40°C ~ +105℃ |
| Sequential Read / Write |
330 MB/s | 240 MB/s |
330 MB/s | 240 MB/s |
| Advanced Flash Management |
Strong LDPC ECC, Auto-Bad Block Management |
Strong LDPC ECC, Auto-Bad Block Management |
| Core Application Scenarios |
Around View Monitoring (AVM/360° Camera), T-BOX, Digital Instrument Cluster |
Smart Cockpit IVI Systems, High-End Multi-Channel Dashcams (Black Box) |
3. In-Depth Insights: Why G2864GTLCA and G28128TLCA are Trusted by Global Tier 1 Suppliers
The automotive supply chain rejects experimental or unproven hardware. As China Chips Star's flagship mature products, G2864GTLCA and G28128TLCA have successfully passed rigorous validation cycles across multiple passenger and commercial vehicle platforms. The underlying firmware has been refined through tens of thousands of hours of field testing, delivering a Bad Block Ratio and firmware lock-up rate significantly lower than the industry average.
By providing a standardized register interface, the vehicle's host processor (SoC) can fetch real-time, precise telemetry from the eMMC, including Life Time Estimation (flash consumption percentage), Average Erase Count, and real-time internal temperature. This allows the IVI system to trigger early warning alerts well before the chip nears its end-of-life, assisting Tier 1s and OEMs in completely eliminating the risk of sudden system blackouts due to storage failures.
Vehicles are designed to stay on the road for a decade or more. China Chips Star guarantees long-term supply availability for both G2864GTLCA and G28128TLCA. This long-life cycle commitment protects Tier 1 suppliers and OEMs from the massive R&D costs and re-certification delays associated with component EOL (End of Life). Furthermore, our dedicated overseas Field Application Engineering (FAE) teams stand ready to provide customized firmware tuning for specific automotive OS environments (Linux, Android, QNX, etc.).
About China Chips Star
China Chips Star is an international enterprise dedicated to the R&D and supply of high-reliability, security-focused memory storage chips. Our product portfolio spans automotive and industrial-grade eMMC, Memory Cards, UFS, and NAND Flash, serving top-tier clients in automotive electronics, industrial automation, and the IoT ecosystem. Committed to rigorous quality control and resilient supply chain management, we deliver premium memory solutions with distinct Total Cost of Ownership (TCO) advantages.
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